HiSilicon Kirin 970
About processor
Kirin 970 is a SmartPhone Flagship mobile processor manufactured by HiSilicon. It was released on September 2017. The SoC is manufactured using the 10 nm fabrication process. It has 8 cores. The main feachers of the SoC are: L2 Cache - 2 MB, Frequency - 2360 MHz, TDP - 9 W. This chip also integrates the Mali-G72 MP12.
Basic
Label Name
HiSilicon
Platform
SmartPhone Flagship
Launch Date
September 2017
Manufacturing
TSMC
Model Name
Hi3670
Architecture
4x 2.36 GHz – Cortex A73
4x 1.84 GHz – Cortex A53
4x 1.84 GHz – Cortex A53
Cores
8
Technology
10 nm
Frequency
2360 MHz
Transistor count
5.5
GPU Specifications
GPU name
Mali-G72 MP12
GPU frequency
768 MHz
FLOPS
0.3318 TFLOPS
Shading units
18
Execution units
12
OpenCL version
2.0
Vulkan version
1.3
Max display resolution
3120 x 1440
DirectX version
12
Connectivity
4G support
LTE Cat. 18
5G support
No
Bluetooth
4.2
Wi-Fi
5
Navigation
GPS, GLONASS, Beidou, Galileo
Memory Specifications
Memory type
LPDDR4X
Memory frequency
1866 MHz
Memory Bus
4x 16 Bit
Miscellaneous
Neural processor (NPU)
Yes
L2 Cache
2 MB
Audio codecs
32 bit@384 kHz, HD-audio
Max camera resolution
1x 48MP, 2x 20MP
Storage type
UFS 2.1
Video capture
4K at 30FPS
Video codecs
H.264, H.265, VP8, VP9, VC-1
Video playback
4K at 30FPS
TDP
9 W
Instruction set
ARMv8-A
Benchmarks
Geekbench 6
Single Core
Score
386
Geekbench 6
Multi Core
Score
1377
FP32 (float)
Score
324
AnTuTu 10
Score
363065
Compared to Other SoC
Geekbench 6 Single Core
Geekbench 6 Multi Core
FP32 (float)
AnTuTu 10
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