Qualcomm Snapdragon 888
vs
MediaTek Dimensity 8350

vs

SoC Comparison Result

Below are the results of a comparison of Qualcomm Snapdragon 888 and MediaTek Dimensity 8350 mobile processors based on key performance characteristics, as well as power consumption and much more.

Advantages

  • Higher Technology: 4 nm (5 nm vs 4 nm)
  • Higher Frequency: 3350 MHz (2840 MHz vs 3350 MHz)
  • Newer Launch Date: November 2024 (December 2020 vs November 2024)

Basic

Qualcomm
Label Name
MediaTek
December 2020
Launch Date
November 2024
SmartPhone Flagship
Platform
SmartPhone Mid range
-
Manufacturing
TSMC
SM8350
Model Name
MT6897 MT6897Z_A/ZA MT8792Z/NA
1x 2.84 GHz – Kryo 680 Prime (Cortex-X1)
3x 2.42 GHz – Kryo 680 Gold (Cortex-A78)
4x 1.8 GHz – Kryo 680 Silver (Cortex-A55)
Architecture
1x 3.35 GHz – Cortex-A715, 3x 3.2 GHz – Cortex-A715, 4x 2.2 GHz – Cortex-A510
8
Cores
8
5 nm
Technology
4 nm
2840 MHz
Frequency
3350 MHz

GPU Specifications

Adreno 660
GPU name
Mali-G615 MP6
840 MHz
GPU frequency
1400 MHz
1.72 TFLOPS
FLOPS
2.1504 TFLOPS
512
Shading units
128
2
Execution units
-
2.0
OpenCL version
2.0
1.1
Vulkan version
1.3
3840 x 2160
Max display resolution
2960 x 1440
12
DirectX version
-

Connectivity

LTE Cat. 22
4G support
LTE Cat. 24
-
5G support
Yes
5.2
Bluetooth
5.4
6
Wi-Fi
6
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

LPDDR5
Memory type
LPDDR5X
3200 MHz
Memory frequency
4266 MHz
4x 16 Bit
Memory Bus
4x 16 Bit

Miscellaneous

Hexagon 780
Neural processor (NPU)
MediaTek APU 780
1 MB
L2 Cache
-
-
L3 cache
4 MB
AAC, AIFF, CAF, MP3, MP4, WAV
Audio codecs
- AAC LC
- FLAC
- HE-AACv1
- HE-AACv2
- MP3
1x 200MP, 2x 25MP
Max camera resolution
1x 320MP
UFS 3.0, UFS 3.1
Storage type
UFS 4.0
8K at 30FPS, 4K at 120FPS
Video capture
4K at 60FPS
H.264, H.265, VP8, VP9
Video codecs
- H.264
- H.265
- AV1
- VP9
8K at 30FPS
Video playback
4K at 60FPS
10 W
TDP
-
ARMv8.4-A
Instruction set
ARMv9-A

Benchmarks

Geekbench 6 Single Core
Snapdragon 888
1481 +14%
Dimensity 8350
1298
Geekbench 6 Multi Core
Snapdragon 888
3794
Dimensity 8350
4368 +15%
FP32 (float)
Snapdragon 888
1754
Dimensity 8350
2172 +24%

Comparison of Devices

3DMark Steel Nomad Light
Lenovo Legion Phone Dual 2 / 2 Pro
Qualcomm Snapdragon 888
529
Realme P3 Ultra
MediaTek Dimensity 8350
1319
3DMark Steel Nomad Light Unlimited
Realme GT 5G
Qualcomm Snapdragon 888
293
Oppo Reno13 Pro
MediaTek Dimensity 8350
1198