Qualcomm Snapdragon 7s Gen 3 vs MediaTek Dimensity 7300
SoC Comparison Result
Below are the results of a comparison of Qualcomm Snapdragon 7s Gen 3 and MediaTek Dimensity 7300 mobile processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Newer Launch Date: August 2024 (August 2024 vs June 2024)
- Higher Max Bandwidth: 51.2 Gbit/s (25.6 Gbit/s vs 51.2 Gbit/s)
Basic
Qualcomm
Label Name
MediaTek
August 2024
Launch Date
June 2024
SmartPhone Mid range
Platform
SmartPhone Mid range
TSMC
Manufacturing
TSMC
SM7635
Model Name
Dimensity 7300
1x 2.5 GHz – Kryo Prime
3x 2.4 GHz – Kryo Gold
4x 1.8 GHz – Kryo Silver
Architecture
4x 2.5 GHz – Cortex-A78
4x 2 GHz – Cortex-A55
8
Cores
8
4 nm
Technology
4 nm
2500 MHz
Frequency
2500 MHz
GPU Specifications
-
GPU name
Mali-G615 MP6
-
Execution units
6
-
OpenCL version
2.0
-
Vulkan version
1.3
3360 x 1600
Max display resolution
2520 x 1080
Connectivity
Yes
5G support
Yes
5.4
Bluetooth
5.4
6
Wi-Fi
6
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
LPDDR5
Memory type
LPDDR5
3200 MHz
Memory frequency
3200 MHz
2x 16 Bit
Memory Bus
4x 16 Bit
25.6 Gbit/s
Max Bandwidth
51.2 Gbit/s
Miscellaneous
Yes
Neural processor (NPU)
MediaTek APU 655
AAC, AIFF, CAF, MP3, MP4, WAV
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
1x 200MP
Max camera resolution
1x 200MP
UFS 2.2, UFS 3.1
Storage type
UFS 3.1
4K at 30FPS
Video capture
4K at 30FPS
H.264, H.265
Video codecs
H.264, H.265, VP9
4K at 30FPS
Video playback
4K at 30FPS
ARMv8.6-A
Instruction set
ARMv8.2-A
Benchmarks
Geekbench 6 Single Core
Snapdragon 7s Gen 3
1196
+12%
Dimensity 7300
1064
Geekbench 6 Multi Core
Snapdragon 7s Gen 3
3087
+5%
Dimensity 7300
2939
AnTuTu 10
Snapdragon 7s Gen 3
809304
+11%
Dimensity 7300
726869
