Advantages
- Higher Frequency: 3400 MHz (3400 MHz vs 2500 MHz)
- Newer Launch Date: January 2026 (January 2026 vs August 2024)
Basic
MediaTek
Label Name
Qualcomm
January 2026
Launch Date
August 2024
SmartPhone Mid range
Platform
SmartPhone Mid range
TSMC
Manufacturing
TSMC
Dimensity 8500
Model Name
SM7635
1x 3.4 GHz – Cortex-A725, 3x 3.2 GHz – Cortex-A725, 4x 2.2 GHz – Cortex-A725
Architecture
1x 2.5 GHz – Kryo Prime
3x 2.4 GHz – Kryo Gold
4x 1.8 GHz – Kryo Silver
3x 2.4 GHz – Kryo Gold
4x 1.8 GHz – Kryo Silver
8
Cores
8
4 nm
Technology
4 nm
3400 MHz
Frequency
2500 MHz
GPU Specifications
Mali-G720 MС8
GPU name
-
128
Shading units
-
3.2
OpenCL version
-
1.3
Vulkan version
-
2960 x 1440
Max display resolution
3360 x 1600
Connectivity
-
Download speed
Up to 2900 Mbps
Yes
5G support
Yes
5.4
Bluetooth
5.4
Wi-Fi 6E (a/b/g/n/ac/ax)
Wi-Fi
6
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
LPDDR5X
Memory type
LPDDR5
4800 MHz
Memory frequency
3200 MHz
4x 16 Bit
Memory Bus
2x 16 Bit
Miscellaneous
- AAC LC - FLAC - HE-AACv1 - HE-AACv2 - MP3
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
1x 320MP, 3x 32MP
Max camera resolution
1x 200MP
UFS 4 + MCQ
Storage type
UFS 2.2, UFS 3.1
4K at 60FPS
Video capture
4K at 30FPS
- H.264 - H.265 - AV1 - VP9
Video codecs
H.264, H.265
4K at 60FPS
Video playback
4K at 30FPS
ARMv9.2-A
Instruction set
ARMv8.6-A
MediaTek NPU 880
Neural processor (NPU)
Yes
Benchmarks
Geekbench 6 Single Core
Dimensity 8500
1693
+42%
Snapdragon 7s Gen 3
1196
Geekbench 6 Multi Core
Dimensity 8500
6897
+123%
Snapdragon 7s Gen 3
3087
AnTuTu 10
Dimensity 8500
2359462
+192%
Snapdragon 7s Gen 3
809304
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