MediaTek Dimensity 7360 vs Qualcomm Snapdragon 7s Gen 3
SoC Comparison Result
Below are the results of a comparison of
MediaTek Dimensity 7360
and
Qualcomm Snapdragon 7s Gen 3
mobile processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Newer Launch Date: July 2025 (July 2025 vs August 2024)
- Higher Frequency: 2500 MHz (Up to 2.5 GHz vs 2500 MHz)
Basic
MediaTek
Label Name
Qualcomm
July 2025
Launch Date
August 2024
SmartPhone Mid range
Platform
SmartPhone Mid range
-
Manufacturing
TSMC
Dimensity 7360 (MT678V)
Model Name
SM7635
4× Cortex-A78 up to 2.5 GHz + 4× Cortex-A55
Architecture
1x 2.5 GHz – Kryo Prime3x 2.4 GHz – Kryo Gold4x 1.8 GHz – Kryo Silver
Octa (8)
Cores
8
4 nm
Technology
4 nm
Up to 2.5 GHz
Frequency
2500 MHz
GPU Specifications
Arm Mali-G615 MC2
GPU name
-
WFHD+ @ 120 Hz; FHD+ @ 144 Hz
Max display resolution
3360 x 1600
Connectivity
LTE (FDD/TDD), 4G CA; WCDMA; TD-SCDMA; CDMA2000 1x/EVDO; GSM/EDGE
4G support
-
5G R16; NR DL 3CC (140 MHz); SA/NSA; DL up to 3.27 Gbps; 4×4 MIMO; 256QAM UL 2CC; VoNR / EPS fallback
5G support
Yes
Bluetooth 5.4
Bluetooth
5.4
Wi-Fi 6E (802.11 a/b/g/n/ac/ax), 2×2 (2T2R)
Wi-Fi
6
GPS; BeiDou; GLONASS; Galileo; QZSS; NavIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
LPDDR5 / LPDDR4x
Memory type
LPDDR5
Up to 6400 Mbps
Memory frequency
3200 MHz
-
Memory Bus
2x 16 Bit
Miscellaneous
MediaTek NPU 655 (6th gen)
Neural processor (NPU)
Yes
-
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
Up to 200 MP
Max camera resolution
1x 200MP
UFS 3.1
Storage type
UFS 2.2, UFS 3.1
4K30 (3840 × 2160)
Video capture
4K at 30FPS
H.264, HEVC (encode/decode); VP9 (decode)
Video codecs
H.264, H.265
H.264, HEVC, VP9 playback
Video playback
4K at 30FPS
ARMv8.2-A (64-bit)
Instruction set
ARMv8.6-A
Benchmarks
Geekbench 6 Single Core
Dimensity 7360
1015
Snapdragon 7s Gen 3
1196
+18%
Geekbench 6 Multi Core
Dimensity 7360
2932
Snapdragon 7s Gen 3
3087
+5%
AnTuTu 10
Dimensity 7360
715000
Snapdragon 7s Gen 3
809304
+13%
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