MediaTek Dimensity 6400
vs
Qualcomm Snapdragon 6s Gen 3
vs
SoC Comparison Result
Below are the results of a comparison of
MediaTek Dimensity 6400
and
Qualcomm Snapdragon 6s Gen 3
mobile processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Higher Frequency: 2500 MHz (2500 MHz vs 2300 MHz)
- Newer Launch Date: February 2025 (February 2025 vs June 2024)
Basic
MediaTek
Label Name
Qualcomm
February 2025
Launch Date
June 2024
SmartPhone Mid range
Platform
SmartPhone Mid range
TSMC
Manufacturing
TSMC
Dimensity 6400
Model Name
SM6375-AC
2x 2.5 GHz – Cortex-A766x 2 GHz – Cortex-A55
Architecture
2x 2.3 GHz – Cortex-A78
6x 2 GHz – Cortex-A55
6x 2 GHz – Cortex-A55
8
Cores
8
6 nm
Technology
6 nm
2500 MHz
Frequency
2300 MHz
GPU Specifications
Mali-G57 MP2
GPU name
Adreno 619
64
Shading units
128
-
Execution units
2
2.0
OpenCL version
2.0
1.3
Vulkan version
1.1
2520 x 1080
Max display resolution
2520 x 1080
12
DirectX version
12.1
Connectivity
Up to 3300 Mbps
Download speed
Up to 2500 Mbps
-
4G support
LTE Cat. 18
Yes
5G support
Yes
5.4
Bluetooth
5.2
5
Wi-Fi
5
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
LPDDR4X
Memory type
LPDDR4X
2133 MHz
Memory frequency
2133 MHz
2x 16 Bit
Memory Bus
2x 16 Bit
Miscellaneous
1 MB
L2 Cache
-
2 MB
L3 cache
-
- AAC LC - FLAC - HE-AACv1 - HE-AACv2 - MP3
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
1x 108MP, 2x 16MP
Max camera resolution
1x 108MP
UFS 2.2
Storage type
UFS 2.2
2K at 30FPS
Video capture
1K at 60FPS
- H.264 - H.265 - VP9
Video codecs
H.264, H.265, VP9
2K at 30FPS
Video playback
1080p at 60FPS
-
TDP
4 W
ARMv8.2-A
Instruction set
ARMv8.2-A
Yes
Neural processor (NPU)
Hexagon
Benchmarks
Geekbench 6 Single Core
Dimensity 6400
819
Snapdragon 6s Gen 3
929
+13%
Geekbench 6 Multi Core
Dimensity 6400
2116
+5%
Snapdragon 6s Gen 3
2013
AnTuTu 10
Dimensity 6400
437112
Snapdragon 6s Gen 3
622608
+42%
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