MediaTek Dimensity 6300 vs Qualcomm Snapdragon 778G
SoC Comparison Result
Below are the results of a comparison of MediaTek Dimensity 6300 and Qualcomm Snapdragon 778G mobile processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Newer Launch Date: April 2024 (April 2024 vs May 2021)
- Higher Max Bandwidth: 25.6 Gbit/s (17.07 Gbit/s vs 25.6 Gbit/s)
Basic
MediaTek
Label Name
Qualcomm
April 2024
Launch Date
May 2021
SmartPhone Mid range
Platform
SmartPhone Mid range
TSMC
Manufacturing
-
Dimensity 6300
Model Name
SM7325
2x 2.4 GHz – Cortex-A76
6x 2 GHz – Cortex-A55
Architecture
1x 2.4 GHz – Kryo 670 Prime (Cortex-A78)
3x 2.2 GHz – Kryo 670 Gold (Cortex-A78)
4x 1.9 GHz – Kryo 670 Silver (Cortex-A55)
8
Cores
8
6 nm
Technology
6 nm
2400 MHz
Frequency
2400 MHz
GPU Specifications
Mali-G57 MP2
GPU name
Adreno 642L
-
GPU frequency
490 MHz
64
Shading units
384
2
Execution units
2
2.0
OpenCL version
2.0
1.3
Vulkan version
1.1
2520 x 1080
Max display resolution
2520 x 1080
-
DirectX version
12
Connectivity
-
4G support
LTE Cat. 24
Yes
5G support
是
5.2
Bluetooth
5.2
5
Wi-Fi
6
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
Memory Specifications
LPDDR4X
Memory type
LPDDR5
2133 MHz
Memory frequency
3200 MHz
2x 16 Bit
Memory Bus
2x 16 Bit
17.07 Gbit/s
Max Bandwidth
25.6 Gbit/s
Miscellaneous
Yes
Neural processor (NPU)
Hexagon 770
-
L2 Cache
2 MB
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
1x 108MP, 2x 16MP
Max camera resolution
1x 192MP, 2x 36MP
UFS 2.2
Storage type
UFS 2.1, UFS 2.2, UFS 3.0, UFS 3.1
2K at 30FPS
Video capture
4K at 30FPS
H.264, H.265, VP9
Video codecs
H.264, H.265, VP8, VP9
2K at 30FPS
Video playback
4K at 30FPS
-
TDP
5 W
ARMv8.2-A
Instruction set
ARMv8.4-A
Benchmarks
Geekbench 6 Single Core
Dimensity 6300
829
Snapdragon 778G
981
+18%
Geekbench 6 Multi Core
Dimensity 6300
2178
Snapdragon 778G
2787
+28%
