HiSilicon Kirin 9010s
vs
Qualcomm Snapdragon 7s Gen 3

vs

SoC Comparison Result

Below are the results of a comparison of HiSilicon Kirin 9010s and Qualcomm Snapdragon 7s Gen 3 mobile processors based on key performance characteristics, as well as power consumption and much more.

Advantages

  • Newer Launch Date: July 2025 (July 2025 vs August 2024)

Basic

HiSilicon
Label Name
Qualcomm
July 2025
Launch Date
August 2024
SmartPhone Flagship
Platform
SmartPhone Mid range
-
Manufacturing
TSMC
Kirin 9010s
Model Name
SM7635
2 cores x 2.5GHz + 6 cores x 2.05GHz + 4 cores x 1.50GHz
Architecture
1x 2.5 GHz – Kryo Prime
3x 2.4 GHz – Kryo Gold
4x 1.8 GHz – Kryo Silver
12
Cores
8
7 nm
Technology
4 nm
-
Frequency
2500 MHz

GPU Specifications

-
GPU name
Adreno 810
-
GPU frequency
1050 MHz
-
OpenCL version
2.0 FP
-
Vulkan version
1.3
-
Max display resolution
FHD+ до 144 Гц

Connectivity

-
Download speed
Up to 2900 Mbps
Yes
4G support
-
-
5G support
Yes
Bluetooth 5.2, поддержка BLE, SBC, AAC, LDAC и L2HC.
Bluetooth
5.4
802.11a/b/g/n/ac/ax/be, 2 × 2 MIMO, EHT160
Wi-Fi
6E
-
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

-
Memory type
LPDDR5, LPDDR4X
-
Memory frequency
3200 MHz
-
Memory Bus
2x 16 Bit

Miscellaneous

-
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
-
Max camera resolution
1x 200MP
-
Storage type
UFS 3.1
-
Video capture
4K at 30FPS
-
Video codecs
H.264, H.265, VP9
-
Video playback
4K at 60FPS
-
Instruction set
ARMv9.2-A
-
Neural processor (NPU)
Qualcomm Hexagon

Benchmarks

Geekbench 6 Single Core
Kirin 9010s
1442 +21%
Snapdragon 7s Gen 3
1196
Geekbench 6 Multi Core
Kirin 9010s
4443 +44%
Snapdragon 7s Gen 3
3087
AntuTu 11
Kirin 9010s
1286775 +24%
Snapdragon 7s Gen 3
1041899