HiSilicon Kirin 9000S
vs
MediaTek Dimensity 6300

vs

SoC Comparison Result

Below are the results of a comparison of HiSilicon Kirin 9000S and MediaTek Dimensity 6300 mobile processors based on key performance characteristics, as well as power consumption and much more.

Advantages

  • Higher Frequency: 2620 MHz (2620 MHz vs 2400 MHz)
  • Higher Technology: 6 nm (14 nm vs 6 nm)
  • Newer Launch Date: April 2024 (August 2023 vs April 2024)

Basic

HiSilicon
Label Name
MediaTek
August 2023
Launch Date
April 2024
SmartPhone Flagship
Platform
SmartPhone Mid range
SMIC
Manufacturing
TSMC
Kirin 9000S
Model Name
Dimensity 6300
2x 2.62 GHz – Cortex-X1
4x 2.15 GHz – Cortex-A710
6x 1.53 GHz – Cortex-A510
Architecture
2x 2.4 GHz – Cortex-A766x 2 GHz – Cortex-A55
12
Cores
8
14 nm
Technology
6 nm
2620 MHz
Frequency
2400 MHz

GPU Specifications

Maleoon 910
GPU name
Mali-G57 MP2
750 MHz
GPU frequency
-
-
Shading units
64
-
Execution units
2
-
OpenCL version
2.0
-
Vulkan version
1.3
3840 x 2160
Max display resolution
2520 x 1080

Connectivity

-
Download speed
Up to 3300 Mbps
LTE Cat. 24
4G support
-
Yes
5G support
Yes
5.2
Bluetooth
5.2
6
Wi-Fi
5
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Memory Specifications

LPDDR5
Memory type
LPDDR4X
2750 MHz
Memory frequency
2133 MHz
4x 16 Bit
Memory Bus
2x 16 Bit

Miscellaneous

AAC, AIFF, CAF, MP3, MP4, WAV
Audio codecs
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
-
Max camera resolution
1x 108MP, 2x 16MP
UFS 4.0
Storage type
UFS 2.2
4K at 60FPS
Video capture
2K at 30FPS
H.264, H.265, VP9
Video codecs
H.264, H.265, VP9
4K at 60FPS
Video playback
2K at 30FPS
7 W
TDP
-
-
Instruction set
ARMv8.2-A
Yes
Neural processor (NPU)
Yes

Benchmarks

Geekbench 6 Single Core
Kirin 9000S
1222 +55%
Dimensity 6300
790
Geekbench 6 Multi Core
Kirin 9000S
3622 +78%
Dimensity 6300
2030
AnTuTu 10
Kirin 9000S
923510 +94%
Dimensity 6300
476569