AMD Ryzen AI 5 330

AMD Ryzen AI 5 330

AMD Ryzen AI 5 330 — an entry-level mobile APU with a 50-TOPS NPU

A compact, entry-level mobile processor for the Copilot+ PC platform. It combines 4 cores/8 threads on Zen 5/Zen 5c, a simple integrated Radeon 820M GPU, and a built-in XDNA 2 NPU rated up to 50 TOPS. It targets thin-and-light laptops and mini-PCs with a focus on efficiency and on-device AI scenarios.

Key specifications

  • Architecture / codename, process node: hybrid Zen 5 + Zen 5c; Ryzen AI 300 family (mobile APU generation); 4 nm node.

  • Cores / threads: 4 / 8 (1 performance Zen 5 and 3 efficiency-oriented Zen 5c; SMT enabled).

  • Frequencies (base; boost): ~2.0 GHz; up to ~4.5 GHz (actual values depend on power/thermal profiles).

  • L3 cache: 8 MB (L2 — 4 MB).

  • Power envelope: default TDP 28 W; cTDP range 15–28 W.

  • Integrated graphics: Radeon 820M (RDNA 3.5), 2 CU / 128 ALUs; aimed at basic 2D/video workloads and light 1080p gaming.

  • Memory: dual-channel DDR5-5600 or LPDDR5X-8000; a full dual-channel configuration is critical.

  • Interfaces: 14 native PCIe 4.0 lanes (allocation varies by OEM), USB4 (up to 40 Gbps, typically 2 ports), USB 3.2 Gen 2 (10 Gbps), output to up to four displays via USB-C (DP Alt Mode)/HDMI depending on implementation.

  • NPU / Ryzen AI: XDNA 2, up to 50 TOPS INT8; enables on-device features (including Copilot+ PC functions in Windows).

  • Optional: performance positioning: below Ryzen AI 5 340/AI 7 350 in multi-thread and graphics; single-thread performance can be close to Zen 5 levels of higher SKUs at similar clocks.

What this chip is and where it fits

Ryzen AI 5 330 is the most affordable member of the Ryzen AI 300 lineup for mobile. The model is intended for mainstream thin laptops, budget Copilot+ systems, and compact mini-PCs where long battery life, quiet operation, and baseline on-device AI capabilities matter. Within the 300-series hierarchy it sits below Ryzen AI 5 340, Ryzen AI 7 350, and AI 9 SKUs, emphasizing cost and efficiency.

Architecture and process

The die uses a hybrid layout: performance Zen 5 cores are paired with efficiency-focused Zen 5c cores. This allows task-type scheduling: peak single-thread bursts on the larger cores, sustained background or service workloads on the compact ones. The cache subsystem includes 4 MB of L2 (1 MB per core) and 8 MB of shared L3 — sufficient for desktop apps, heavy browser use, IDEs, and office suites at the entry tier.

The multimedia blocks support modern video codecs up to AV1 (hardware decode), along with HEVC and H.264; hardware encode capabilities depend on the iGPU media engines, but everyday streaming and video calls are covered. The memory controller supports both socketed DDR5 and high-speed LPDDR5X — the trade-off between latency and bandwidth depends on platform goals and the notebook’s design.

CPU performance

In day-to-day workloads — office apps, browsers with dozens of tabs, video conferencing, light development and builds of smaller projects, simple photo tasks — Ryzen AI 5 330 delivers snappy behavior via Zen 5 IPC and boost clocks up to ~4.5 GHz. In heavily parallel scenarios (large-scale rendering, very big codebases, multi-threaded archiving), four cores/eight threads become the limiting factor; acceleration is bounded by the core count and TDP.

A practical note: results scale with the thermal package and cooling system. In chassis holding TDP at 15–18 W, sustained clocks under long load will be lower than in designs configured at 25–28 W with more robust heatpipes. This primarily affects lengthy batch jobs: the better the cooling and the higher the power limit, the closer sustained performance gets to short-term peaks.

Graphics and multimedia (iGPU)

The integrated Radeon 820M (RDNA 3.5, 2 CU/128 ALUs) targets UI acceleration, media playback, and basic graphics. For games, think 1080p on low/occasionally medium presets in lighter and competitive titles, with wide variation by game and settings. For AAA titles and high presets, a discrete GPU or higher-tier AI 300 APU with more CUs is preferable.

Memory bandwidth strongly affects the iGPU: dual-channel LPDDR5X-8000 delivers better frame pacing than DDR5-5600, though final results depend on timings, controller behavior, and power limits. For media, AV1/HEVC/H.264 hardware decode ensures smooth 4K streaming with low power draw.

AI / NPU

The built-in XDNA 2 NPU rated up to 50 TOPS accelerates on-device AI: speech transformations (captions, noise suppression), video effects (background blur, auto-framing), on-device object recognition, metadata generation, and local inference for moderate-size models. The NPU offloads CPU/GPU, reduces power in those tasks, and satisfies Copilot+ PC requirements. NPU capability is consistent across the Ryzen AI 300 family, simplifying developer targeting.

Platform and I/O

A typical mobile platform around Ryzen AI 5 330 provides:

  • PCIe: 14 native lanes of PCIe 4.0. OEMs split them between NVMe storage and, where present, discrete graphics or high-speed controllers; exact routing varies by device.

  • USB/Thunderbolt: native USB4 (up to 40 Gbps), commonly two fully featured USB-C ports with DP Alt Mode and Power Delivery; plus USB 3.2 Gen 2 (10 Gbps). Thunderbolt interoperability depends on system-level certification.

  • Displays: up to four independent outputs (combinations of USB-C/DP Alt Mode and HDMI), subject to the notebook or mini-PC implementation.

  • Networking & storage: typically Wi-Fi 6E/7 via the OEM’s module, one or two M.2 2280 (PCIe 4.0 ×4) for NVMe, sometimes a card reader slot.

Power consumption and cooling

With a 15–28 W cTDP range and a compact die, the 330 is tailored to slim chassis. In “Balanced”/“Silent” profiles it maintains low temperatures and noise at the expense of sustained performance; in “Performance” profiles sustained clocks are higher but cooling becomes the priority. With sensible fan curves and a competent heatpipe, the CPU avoids pronounced frequency “sawtoothing” under long loads.

Where it appears

Expect Ryzen AI 5 330 in mainstream 13–15-inch entry-level laptops, education and office-oriented models, and compact mini-PCs focused on office work, multimedia, light development, and everyday tasks. Specific series and timelines depend on OEMs.

Comparison and positioning

  • Versus Ryzen AI 5 340: the 340 brings 6 cores/12 threads and Radeon 840M (4 CU), clearly boosting multi-threaded and graphics performance. NPU is the same (50 TOPS); TDP is similar. The 330 trades raw throughput for lower cost and simpler graphics/core counts.

  • Versus Ryzen AI 7 350: 8 cores/16 threads and a stronger iGPU (860M, 8 CU) move the 350 into a different class for rendering, encoding, and gaming. The power envelope is comparable, with greater cooling demands.

  • Versus Ryzen AI 9 (365/370/HX): double-digit core counts, higher boosts, and large iGPUs (880M/890M) define the premium tier. The 330 is the baseline entry to Copilot+ PCs, optimized for efficiency and value.

Who it suits

  • Office and study: documents, spreadsheets, presentations, video calls, note-taking with local transcription — with long battery life.

  • Browsing and everyday tasks: heavy tab use, mail, messaging, online services.

  • Light development and automation: IDE work, builds for small/medium projects, local scripts; for CI with very high parallelism, higher SKUs are advisable.

  • Multimedia: 4K playback, basic clip editing, format conversion without strict deadlines.

  • Entry-level gaming: lighter titles at 1080p on low/medium settings; for AAA or high FPS, aim for a dGPU or higher APU.

Pros and cons

Pros

  • XDNA 2 NPU at 50 TOPS — same AI acceleration level as higher AI 300 models.

  • Modern I/O (USB4, 14 lanes of PCIe 4.0), support for up to four displays.

  • Strong efficiency with a wide 15–28 W cTDP span.

  • Support for fast LPDDR5X memory and hardware AV1 decode.

Cons

  • Only 4 cores/8 threads limit heavily parallel workloads.

  • Radeon 820M with 2 CUs is the minimal 3D tier in the family.

  • Sustained clocks depend noticeably on cooling and power limits.

  • I/O routing and port speeds vary with each notebook design.

Configuration recommendations

  • Memory: strictly dual-channel; for iGPU, prefer LPDDR5X-7500/8000. Capacity — at least 16 GB; 32 GB gives headroom for IDEs, browsers, and media apps.

  • Storage: NVMe PCIe 4.0 ×4; for working datasets, consider two M.2 drives (system + data/cache).

  • Cooling: prioritize designs with a mid-sized fan and heatpipe; “Balanced/Performance” profiles with sensible curves help sustain clocks in long jobs.

  • Power modes: on AC, use “Performance” and allow higher power limits within 25–28 W; on battery, “Balanced” extends runtime with modest performance trade-offs.

  • Graphics/displays: for multi-monitor use, ensure two USB4 ports with DP Alt Mode; for occasional editing and encode offload, lean on AV1/HEVC paths where hardware engines are most efficient.

Summary

Ryzen AI 5 330 is a cost-effective entry to the Copilot+ PC ecosystem: modern Zen 5/Zen 5c architecture, a platform-standard 50-TOPS NPU, and a basic iGPU adequate for UI, video, and light gaming. For heavy multi-thread and 3D workloads, AI 5 340/AI 7 350 with more cores and CUs are better fits, but in compact and affordable laptops the 330 strikes the needed balance of efficiency, contemporary I/O, and on-device AI capability. When priorities are battery life, office/browsing/media, and local AI features, this processor fits the brief; for intensive rendering, wide parallel builds, or high-end gaming, choose a higher-tier SKU or add a discrete GPU.

Basique

Nom de l'étiquette
AMD
Plate-forme
Laptop
Date de lancement
July 2025
Nom du modèle
?
Le numéro du processeur Intel n'est qu'un des nombreux facteurs - avec la marque du processeur, les configurations du système et les références au niveau du système - à prendre en compte lors du choix du processeur adapté à vos besoins informatiques.
Ryzen AI 5 330
Architecture de cœur
Krackan Point 2
Fonderie
TSMC
Génération
Ryzen AI (Zen 5)

Spécifications du CPU

Nombre total de cœurs
?
Les cœurs sont un terme matériel qui décrit le nombre d'unités centrales indépendantes dans un seul composant informatique (puce ou puce).
4
Nombre total de threads
?
Le cas échéant, la technologie Intel® Hyper-Threading est uniquement disponible sur les cœurs Performance.
8
Fréquence de base (P)
2 GHz
Fréquence de base du cœur d'efficacité
2000 MHz
Fréquence Turbo du cœur de performance
?
Fréquence turbo maximale du cœur P dérivée de la technologie Intel® Turbo Boost.
4.5 GHz
Cache L1
80 KB per core
Cache L2
1 MB per core (4MB total)
Cache L3
8 MB
Fréquence du bus
100 MHz
Multiplicateur
20.0
Multiplicateur déverrouillé
No
Socket
?
Le socket est le composant qui assure les connexions mécaniques et électriques entre le processeur et la carte mère.
AMD Socket FP8
Processus de fabrication
?
La lithographie fait référence à la technologie des semi-conducteurs utilisée pour fabriquer un circuit intégré et est exprimée en nanomètres (nm), ce qui indique la taille des caractéristiques construites sur le semi-conducteur.
4 nm
Consommation d'énergie
28 W
Température de fonctionnement maximale
?
La température de jonction est la température maximale autorisée au niveau de la puce du processeur.
100°C
Version PCIe
?
PCI Express est une norme de bus d'extension informatique série à haute vitesse utilisée pour connecter des composants à haute vitesse, remplaçant les anciennes normes telles que AGP, PCI et PCI-X. Elle a subi plusieurs révisions et améliorations depuis sa première publication. PCIe 1.0 a été introduit pour la première fois en 2002, et afin de répondre à la demande croissante de bande passante plus élevée, des versions ultérieures ont été publiées au fil du temps.
4

Spécifications de la mémoire

Types de mémoire
?
Les processeurs Intel® sont disponibles en quatre types différents : monocanal, double canal, triple canal et mode Flex. La vitesse de mémoire maximale prise en charge peut être inférieure lors du remplissage de plusieurs modules DIMM par canal sur des produits prenant en charge plusieurs canaux de mémoire.
LPDDR5x-8000, DDR5-5600
Canaux de mémoire max
?
Le nombre de canaux mémoire fait référence au fonctionnement de la bande passante pour les applications réelles.
2
Support de mémoire ECC
No

Spécifications du GPU

Graphiques intégrés
?
Un GPU intégré fait référence au cœur graphique intégré au processeur CPU. Exploitant les capacités de calcul puissantes et la gestion intelligente de l'efficacité énergétique du processeur, il offre des performances graphiques exceptionnelles et une expérience d'application fluide avec une consommation d'énergie réduite.
Radeon 820M
Fréquence graphique
?
La fréquence dynamique maximale des graphiques fait référence à la fréquence d'horloge de rendu graphique opportuniste maximale (en MHz) qui peut être prise en charge à l'aide des graphiques Intel® HD avec fonction Dynamic Frequency.
2800 MHz
Graphics Core Count
2
DirectX Support
?
DirectX* Support indicates support for a specific version of Microsoft’s collection of APIs (Application Programming Interfaces) for handling multimedia compute tasks.
12
Résolution max
7680x4320 @ 60Hz , 3840x2160 @ 240Hz , 3440x1440 @ 360Hz , 2560x1440 @ 480Hz , 1920x1080 @ 600Hz
Number of Displays Supported
4

Divers

Voies PCIe
14

Benchmarks

Geekbench 6
Monocœur Score
2131
Geekbench 6
Multicœur Score
7079

Comparé aux autres CPU

Geekbench 6 Monocœur
2314 +8.6%
2207 +3.6%
2034 -4.6%
1934 -9.2%
Geekbench 6 Multicœur
8035 +13.5%
7510 +6.1%
6673 -5.7%
6311 -10.8%