AMD EPYC 7303P
About processor
The AMD EPYC 7303P processor is a high-performance CPU designed for server use. With a total of 16 cores and 32 threads, this processor delivers exceptional multitasking capabilities, making it suitable for a wide range of server applications. The large 64MB L3 cache ensures fast access to frequently used data, further boosting overall performance.
One of the standout features of the EPYC 7303P is its relatively low thermal design power (TDP) of 130W, allowing for efficient power consumption while still delivering impressive processing power. This makes it an excellent choice for businesses looking to minimize their energy costs without sacrificing performance.
In addition, the EPYC 7303P is part of AMD's EPYC line, which is known for its reliability and stability in server environments. This processor is also highly scalable and can handle demanding workloads with ease.
Overall, the AMD EPYC 7303P is a top choice for businesses in need of a powerful and efficient server CPU. Its impressive core and thread count, large cache, and low TDP make it a versatile and reliable option for a wide range of server applications.
Basic
Label Name
AMD
Platform
Server
Launch Date
September 2023
Code Name
Milan
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
16
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
32
Basic Frequency
2.4GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Up to 3.4GHz
L3 Cache
64MB
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
SP3
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
7 nm
TDP
130W
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe 4.0 x128
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR4
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
8
Bus Speed
Up to 3200MT/s