Intel Xeon D-1732TE
About processor
The Intel Xeon D-1732TE processor is a powerful and efficient CPU designed for server applications. Built on a 10nm platform and codenamed Ice Lake-D, this processor features 8 total cores and 16 total threads, making it well-suited for handling demanding workloads and multitasking.
With a performance-core base frequency of 1.9 GHz and a max turbo frequency of 3 GHz, the Xeon D-1732TE delivers impressive processing power, ensuring smooth and responsive performance even when running complex tasks. The large 15 MB L3 cache further enhances its ability to handle intensive workloads, boosting overall efficiency and reducing latency.
Despite its impressive performance capabilities, the Xeon D-1732TE maintains a relatively low thermal design power (TDP) of 52 W, making it an energy-efficient choice for server applications. This not only helps reduce power consumption and operating costs but also contributes to a more sustainable and environmentally friendly computing environment.
Overall, the Intel Xeon D-1732TE processor is a versatile and high-performing CPU that is well-suited for a wide range of server applications, making it an excellent choice for businesses and organizations in need of reliable and efficient processing power.
Basic
Label Name
Intel
Platform
Server
Launch Date
February 2022
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Xeon D-1732TE
Code Name
Ice Lake-D
Foundry
Intel
Generation
Xeon D(Ice Lake-D)
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
16
Performance-core Base Frequency
1.9 GHz
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
3 GHz
L1 Cache
80 KB per core
L2 Cache
1.25 MB per core
L3 Cache
15 MB shared
Bus Frequency
100 MHz
Multiplier
19.0
Unlocked Multiplier
No
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Intel BGA 2227
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
10 nm
TDP
52 W
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
4
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR4-2667
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
3
ECC Memory Support
Yes
GPU Specifications
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
N/A
Miscellaneous
PCIe Lanes
16
Benchmarks
Passmark CPU
Single Core
Score
2015
Passmark CPU
Multi Core
Score
14254
Compared to Other CPU
Passmark CPU Single Core
Passmark CPU Multi Core