Qualcomm Snapdragon X2 Elite X2E-78-100
vs
AMD Ryzen Embedded 9800X3D
vs
CPU Comparison Result
Below are the results of a comparison of
Qualcomm Snapdragon X2 Elite X2E-78-100
and
AMD Ryzen Embedded 9800X3D
processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- More Total Cores: 12 (12 vs 8)
- Newer Launch Date: October 2025 (September 2025 vs October 2025)
Basic
Qualcomm
Label Name
AMD
September 2025
Launch Date
October 2025
Laptop
Platform
Embedded
ARM64-Compatible
CPU Architecture
-
3rd Gen Qualcomm Oryon CPU
CPU Name
-
X2E-78-100
Part Number
-
Qualcomm Snapdragon X2 Elite X2E-78-100
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Ryzen Embedded 9800X3D
CPU Specifications
4.0 GHz Single-Core / 4.0 GHz Dual-Core
Boost Frequency
-
3.4 GHz
Performance-core Multi-Core Max Frequency
-
6
Prime Cores
-
4.0 GHz
Prime-core Multi-Core Max Frequency
-
12
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
-
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
16
6
Performance-cores
-
-
Basic Frequency
4.7 GHz
34 MB
Cache
?
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
-
3nm
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
-
-
TDP
120W
Memory Specifications
128-bit
Memory Bus Width
-
LPDDR5x
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR5
128 GB
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
-
152 GB/s
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
-
9523 MT/s
Maximum Memory Speed
-
GPU Specifications
Qualcomm Adreno DPU
Display Processing Unit
-
DisplayPort 1.4
External Display Standard
-
Qualcomm Adreno GPU
GPU Name
-
X2-85
GPU Part Number
-
3 displays at up to 4K at 144 Hz or 5K at 60 Hz
Max External Display Resolution
-
4K at 144 Hz
Max On-Device Display Resolution
-
Embedded DisplayPort (eDP) 1.5
On-Device Display Standard
-
UHD at 60 FPS Encode + 8K at 30 FPS Decode
Video Concurrency
-
AV1, HEVC, AVC: 8K at 60 FPS
Video Decode
-
HEVC, AVC: 8K UHD at 30 FPS; AV1: 8K UHD at 15 FPS, UHD at 60 FPS
Video Encode
-
Qualcomm Adreno VPU
Video Processing Unit
-
1.35 GHz
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
-
DirectX 12.2 Ultimate, Vulkan 1.4, OpenCL 3.0
GPU APIs
-
AI Specifications
Dual Micro NPU on the Qualcomm Sensing Hub
Micro NPU
-
Qualcomm Hexagon NPU
NPU Name
-
80 TOPS (INT8)
NPU Performance
-
Connectivity
Bluetooth LE
Bluetooth Connection Technology
-
Bluetooth 5.4
Bluetooth Version
-
Up to 1000 MHz (5G)
Cellular Bandwidth
-
Snapdragon X75 5G Modem-RF System
Cellular Modem
-
Up to 10 Gbps
Cellular Peak Download Speed
-
Up to 3.5 Gbps
Cellular Peak Upload Speed
-
6 GHz, 5 GHz, 2.4 GHz
Wi-Fi Bands
-
Wi-Fi 7 (802.11be), 802.11ax, 802.11ac, 802.11n, 802.11g, 802.11b, 802.11a
Wi-Fi Standard
-
Qualcomm FastConnect 7800 System
Wireless System
-
Interfaces and Ports
Supported via Dual PCIe 5.0
NVMe Support
-
4
PCIe Gen 4.0 Lanes
-
8
PCIe Gen 5.0 Lanes
-
SDUC with SD Express, SDXC with UHS-I
SD Standard
-
4.0
UFS Version
-
3x USB-C
USB Interface Type
4x USB 3.2 Gen2 + 1x USB 2.0
USB4 (40 Gbps)
USB Version
-
-
PCIe Lanes
28L Gen5
Miscellaneous
Supported
Always Sensing
-
Qualcomm Aqstic Audio Codec, Qualcomm aptX Audio Technology
Audio Technology
-
Up to 36 MP
Dual Camera Support
-
Qualcomm Spectra ISP
Image Signal Processor
-
Dual 18-bit ISPs
ISP Bit Width
-
Snapdragon Guardian Technology
Out-of-Band Manageability
-
-
Security Processor
Yes
Up to 36 MP
Single Camera Support
-
Up to 4K, 30 FPS
Video Capture
-
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