Advantages
- More Total Cores: 12 (12 vs 8)
- Higher Technology: 3nm (3nm vs TSMC 4nm FinFET)
- Newer Launch Date: September 2025 (September 2025 vs December 2023)
Basic
Qualcomm
Label Name
AMD
September 2025
Launch Date
December 2023
Laptop
Platform
Laptop
ARM64-Compatible
CPU Architecture
-
3rd Gen Qualcomm Oryon CPU
CPU Name
-
X2E-78-100
Part Number
-
Qualcomm Snapdragon X2 Elite X2E-78-100
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
AMD Ryzen 7 8845H
-
Code Name
Hawk Point
-
Foundry
TSMC
-
Generation
Ryzen 8000 Series
-
OS Support
Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit
CPU Specifications
4.0 GHz Single-Core / 4.0 GHz Dual-Core
Boost Frequency
-
3.4 GHz
Performance-core Multi-Core Max Frequency
-
6
Prime Cores
-
4.0 GHz
Prime-core Multi-Core Max Frequency
-
12
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
-
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
16
6
Performance-cores
-
-
Basic Frequency
3.8 GHz
-
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
5.1 GHz
-
Instruction Set Extensions
AES, AMD-V, AVX, AVX2, AVX512, FMA3, MMX-plus, SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64
-
L2 Cache
8 MB
-
L3 Cache
16 MB
34 MB
Cache
?
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
L2: 8 MB, L3: 16 MB
-
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FP7, FP7r2, FP8
-
Unlocked for Overclocking
?
AMD`s product warranty does not cover damages caused by overclocking, even when overclocking is enabled via AMD hardware and/or software. GD-26.
No
3nm
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TSMC 4nm FinFET
-
TDP
45W
-
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
100°C
-
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
PCIe 4.0
Memory Specifications
128-bit
Memory Bus Width
-
LPDDR5x
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR5 (FP7r2), LPDDR5X (FP7-FP8)
128 GB
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
256 GB
-
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
152 GB/s
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
-
9523 MT/s
Maximum Memory Speed
DDR5-5600, LPDDR5X-7500
-
ECC Memory Support
?
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
No
GPU Specifications
Qualcomm Adreno DPU
Display Processing Unit
-
DisplayPort 1.4
External Display Standard
-
Qualcomm Adreno GPU
GPU Name
-
X2-85
GPU Part Number
-
3 displays at up to 4K at 144 Hz or 5K at 60 Hz
Max External Display Resolution
-
4K at 144 Hz
Max On-Device Display Resolution
-
Embedded DisplayPort (eDP) 1.5
On-Device Display Standard
-
UHD at 60 FPS Encode + 8K at 30 FPS Decode
Video Concurrency
-
AV1, HEVC, AVC: 8K at 60 FPS
Video Decode
-
HEVC, AVC: 8K UHD at 30 FPS; AV1: 8K UHD at 15 FPS, UHD at 60 FPS
Video Encode
-
Qualcomm Adreno VPU
Video Processing Unit
-
-
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
AMD Radeon 780M
-
Graphics Core Count
12
1.35 GHz
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
2700 MHz
-
DirectX Support
?
DirectX* Support indicates support for a specific version of Microsoft’s collection of APIs (Application Programming Interfaces) for handling multimedia compute tasks.
12
-
Max Resolution (DP)
?
Max Resolution (DP) is the maximum resolution supported by the processor via the DP interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.
7680x4320 @ 60Hz
-
Number of Displays Supported
4
DirectX 12.2 Ultimate, Vulkan 1.4, OpenCL 3.0
GPU APIs
-
-
Graphics Output
?
Graphics Output defines the interfaces available to communicate with display devices.
DisplayPort 2.1, HDMI 2.1, USB Type-C DisplayPort Alt Mode
AI Specifications
Dual Micro NPU on the Qualcomm Sensing Hub
Micro NPU
-
Qualcomm Hexagon NPU
NPU Name
-
80 TOPS (INT8)
NPU Performance
-
Connectivity
Bluetooth LE
Bluetooth Connection Technology
-
Bluetooth 5.4
Bluetooth Version
-
Up to 1000 MHz (5G)
Cellular Bandwidth
-
Snapdragon X75 5G Modem-RF System
Cellular Modem
-
Up to 10 Gbps
Cellular Peak Download Speed
-
Up to 3.5 Gbps
Cellular Peak Upload Speed
-
6 GHz, 5 GHz, 2.4 GHz
Wi-Fi Bands
-
Wi-Fi 7 (802.11be), 802.11ax, 802.11ac, 802.11n, 802.11g, 802.11b, 802.11a
Wi-Fi Standard
-
Qualcomm FastConnect 7800 System
Wireless System
-
Interfaces and Ports
Supported via Dual PCIe 5.0
NVMe Support
-
4
PCIe Gen 4.0 Lanes
-
8
PCIe Gen 5.0 Lanes
-
SDUC with SD Express, SDXC with UHS-I
SD Standard
-
4.0
UFS Version
-
3x USB-C
USB Interface Type
-
USB4 (40 Gbps)
USB Version
-
-
PCIe Lanes
20 total / 20 usable
Miscellaneous
Supported
Always Sensing
-
Qualcomm Aqstic Audio Codec, Qualcomm aptX Audio Technology
Audio Technology
-
Up to 36 MP
Dual Camera Support
-
Qualcomm Spectra ISP
Image Signal Processor
-
Dual 18-bit ISPs
ISP Bit Width
-
Snapdragon Guardian Technology
Out-of-Band Manageability
-
Up to 36 MP
Single Camera Support
-
Up to 4K, 30 FPS
Video Capture
-
Related CPU Comparisons
Share in social media
Or Link To Us
<a href="https://cputronic.com/cpu/compare/qualcomm-snapdragon-x2-elite-x2e-78-100-vs-amd-ryzen-7-8845h" target="_blank">Qualcomm Snapdragon X2 Elite X2E-78-100 vs AMD Ryzen 7 8845H</a>