Qualcomm Snapdragon X Plus X1P-66-100
vs
Apple M1 Pro
vs
CPU Comparison Result
Below are the results of a comparison of
Qualcomm Snapdragon X Plus X1P-66-100
and
Apple M1 Pro
processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Higher Technology: 4nm (4nm vs 5 nm)
- Newer Launch Date: September 2024 (September 2024 vs October 2021)
Basic
Qualcomm
Label Name
Apple
September 2024
Launch Date
October 2021
Laptop
Platform
Laptop
64-bit architecture
CPU Architecture
Apple Firestorm + Apple Icestorm
Qualcomm Oryon CPU
CPU Name
Apple M1 Pro
X1P-66-100
Part Number
T6000
Qualcomm Snapdragon X Plus X1P-66-100
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Apple M1 Pro
-
Foundry
TSMC
-
Generation
Apple M1 series
CPU Specifications
4.0 GHz Single-Core
Boost Frequency
-
-
Performance Cores
8
10
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
10
-
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
10
-
Efficient-cores
2
-
Efficient-core Max Turbo Frequency
?
Maximum E-core turbo frequency derived from Intel® Turbo Boost Technology.
2.064 GHz
-
Instruction Set Extensions
NEON
-
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
3.228 GHz
-
Extended Instruction Set
ARMv8-A, NEON
-
L1 Cache
P-cores: 192 KB instruction + 128 KB data per core; E-cores: 128 KB instruction + 64 KB data per core
-
L2 Cache
P-core cluster: 24 MB; E-core cluster: 4 MB
-
L3 Cache
24 MB system level cache
42 MB
Cache
?
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
-
4nm
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
5 nm
-
Instruction Set
?
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
ARMv8-A
-
Transistor Count
33.7 billion
Memory Specifications
16-bit x 8 channels
Memory Bus Width
256-bit
LPDDR5x
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
Unified LPDDR5-6400
-
LPDDR5 Speed
LPDDR5-6400
64 GB
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
32 GB
8
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
-
135 GB/s
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
200 GB/s
8448 MT/s
Maximum Memory Speed
6400 MT/s
GPU Specifications
Qualcomm Adreno DPU
Display Processing Unit
-
DisplayPort 1.4
External Display Standard
-
DirectX 12
GPU APIs
Metal, OpenCL
Qualcomm Adreno GPU
GPU Name
Apple M1 Pro GPU
X1-85
GPU Part Number
-
3 displays up to UHD 60 Hz HDR10; 2 displays up to 5K 60 Hz
Max External Display Resolution
-
Up to UHD120 HDR10
Max On-Device Display Resolution
-
-
Media Engine
Hardware-accelerated H.264, HEVC, ProRes, and ProRes RAW
eDP v1.4b
On-Device Display Standard
-
-
ProRes Encode/Decode Engines
1
4K 60 FPS 8-bit and 10-bit decode + 4K UHD 30 FPS 8-bit encode + 4K UHD 30 FPS 8-bit Miracast
Video Concurrency
Multiple streams of 4K and 8K ProRes video
4K 60 FPS 10-bit HEVC, VP9, AV1; 4K 60 FPS 8-bit H.264; 4K 120 FPS 8-bit HEVC
Video Decode
H.264, HEVC, ProRes, ProRes RAW
-
Video Decode Engines
1
4K UHD 30 FPS 8-bit HEVC, AV1; 4K UHD 60 FPS 8-bit H.264
Video Encode
H.264, HEVC, ProRes, ProRes RAW
-
Video Encode Engines
1
Qualcomm Adreno VPU
Video Processing Unit
Apple media engine with ProRes acceleration
-
GPU Base Frequency
389 MHz
-
GPU Max Dynamic Frequency
1296 MHz
1.25 GHz
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
-
-
Graphics Core Count
16
-
Number of Displays Supported
Up to 2 external displays
3.8 TFLOPS
Graphics Performance
Up to 5.3 TFLOPS FP32
-
OpenCL Support
?
OpenCL (Open Computing Language) is a multi-platform API (Application Programming Interface) for heterogeneous parallel programming.
Yes
AI Specifications
-
AI Engine
16-core Apple Neural Engine
Dual Micro NPU on the Qualcomm Sensing Hub
Micro NPU
-
-
Neural Engine Core Count
16
Qualcomm Hexagon NPU
NPU Name
Apple Neural Engine
45 TOPS
NPU Performance
11 TOPS INT8
Connectivity
Bluetooth LE
Bluetooth Connection Technology
-
-
Bluetooth Support
Yes
Bluetooth 5.4
Bluetooth Version
Bluetooth 5.0
1000 MHz bandwidth mmWave, 300 MHz bandwidth sub-6 GHz
Cellular Bandwidth
-
Snapdragon X65 5G Modem-RF System
Cellular Modem
-
10 Gbps
Cellular Peak Download Speed
-
3.5 Gbps
Cellular Peak Upload Speed
-
6 GHz, 5 GHz, 2.4 GHz
Wi-Fi Bands
-
Wi-Fi 7, Wi-Fi 6E, Wi-Fi 6; 802.11be, 802.11ax, 802.11ac, 802.11n, 802.11g, 802.11b, 802.11a
Wi-Fi Standard
Wi-Fi 6 (802.11ax)
Qualcomm FastConnect 7800 Mobile Connectivity System
Wireless System
-
Interfaces and Ports
NVMe SSD over PCIe Gen 4
NVMe Support
-
SD v3.0
SD Standard
-
-
Thunderbolt Support
Yes, Thunderbolt 4 up to 40 Gb/s
4.0
UFS Version
-
3x USB-C; 3x USB4, 2x USB3.2 Gen2, 1x eUSB2
USB Interface Type
-
USB4
USB Version
USB4
-
USB4 Support
Yes, USB4 up to 40 Gb/s
Miscellaneous
Supported
Always Sensing
-
Qualcomm Aqstic Audio technology, Qualcomm aptX Audio
Audio Technology
-
2x 36 MP
Dual Camera Support
-
-
Hardware-Verified Secure Boot
Yes, Apple silicon secure boot chain of trust
Qualcomm Spectra ISP
Image Signal Processor
Apple image signal processor
Dual 18-bit ISPs
ISP Bit Width
-
-
Runtime Anti-Exploitation
Kernel Integrity Protection, Pointer Authentication Codes, Fast Permission Restrictions
Qualcomm Secure Processing Unit with Microsoft Pluton TPM
Security Processor
Secure Enclave
Up to 64 MP
Single Camera Support
-
4K HDR
Video Capture
-
Benchmarks
Cinebench R23 Single Core
Snapdragon X Plus X1P-66-100
1148
Apple M1 Pro
1534
+34%
Cinebench R23 Multi Core
Snapdragon X Plus X1P-66-100
8794
Apple M1 Pro
12370
+41%
Geekbench 6 Single Core
Snapdragon X Plus X1P-66-100
2380
Apple M1 Pro
2386
+0%
Geekbench 6 Multi Core
Snapdragon X Plus X1P-66-100
13499
+9%
Apple M1 Pro
12359
Cinebench 2024 Single Core
Snapdragon X Plus X1P-66-100
109
Apple M1 Pro
112
+3%
Cinebench 2024 Multi Core
Snapdragon X Plus X1P-66-100
816
Apple M1 Pro
824
+1%
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