Home / CPU Comparison / Apple M1 Pro or Intel Core Ultra 5 225F: What's better?

Apple M1 Pro

vs

Intel Core Ultra 5 225F

CPU Comparison Result

Below are the results of a comparison of Apple M1 Pro and Intel Core Ultra 5 225F processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Apple M1 Pro

Higher Technology: 5 nm (5 nm vs 7 nm)

Intel Core Ultra 5 225F

Higher Performance-core Max Turbo Frequency: 4.9 GHz (3.2 GHz vs 4.9 GHz)
Newer Launch Date: October 2024 (October 2021 vs October 2024)

Basic

Apple

Label Name

Intel

October 2021

Launch Date

October 2024

Laptop

Platform

Desktop

M1 Pro

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Core Ultra 5 225F

Code Name

Arrow Lake-S

Foundry

Intel

Generation

Ultra 5 (Arrow Lake)

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

2.0 GHz

Performance-core Base Frequency

3.3 GHz

Efficient-core Base Frequency

2.7 GHz

3.2 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

4.9 GHz

Efficient-core Max Turbo Frequency

Maximum E-core turbo frequency derived from Intel® Turbo Boost Technology.

4.4 GHz

192K per core

L1 Cache

112 KB per core

24MB shared

L2 Cache

3 MB per core

L3 Cache

21 MB shared

Apple M-Socket

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Intel Socket 1851

Bus Frequency

100 MHz

Multiplier

33.0

Unlocked Multiplier

5 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

7 nm

30 W

TDP

65 W

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100 °C

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

Memory Specifications

LPDDR5-6400

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5-5600

32GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

256 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

102.4 GB/s

ECC Memory Support

GPU Specifications

True

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.