Home / CPU Comparison / Intel Core Ultra 7 270K Plus or Apple M6 12 Cores: What's better?

Intel Core Ultra 7 270K Plus

vs

Apple M6 12 Cores

CPU Comparison Result

Below are the results of a comparison of Intel Core Ultra 7 270K Plus and Apple M6 12 Cores processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Intel Core Ultra 7 270K Plus

More Total Cores: 24 (24 vs 12)
Higher Memory Type: DDR5-7200 (DDR5-7200 vs Unified memory)

Apple M6 12 Cores

Higher Technology: 2 nm (3 nm vs 2 nm)
Newer Launch Date: August 2026 (March 2026 vs August 2026)

Basic

Intel

Label Name

Apple

March 2026

Launch Date

August 2026

Desktop

Platform

Laptop

CPU Name

Apple M6

270K+

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Apple M6 12 Cores

Arrow Lake

Code Name

Intel

Foundry

TSMC N2

Ultra 7 (Arrow Lake)

Generation

CPU Specifications

Performance-core Multi-Core Max Frequency

4.61 GHz

Super-core Max Frequency

4.80 GHz

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

Super-cores

3.7 GHz

Performance-core Base Frequency

3.2 GHz

Efficient-core Base Frequency

4.7 GHz

Efficient-core Max Turbo Frequency

Maximum E-core turbo frequency derived from Intel® Turbo Boost Technology.

3.20 GHz

5.5 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

40 MB

L2 Cache

36 MB shared

L3 Cache

100 MHz

Bus Frequency

FCLGA-1851

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Multiplier

Yes

Unlocked Multiplier

3 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

2 nm

125W

TDP

105 °C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

5.0

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

x86-64

Instruction Set

The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.

17.8 billions

Transistor Count

Memory Specifications

DDR5-7200

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Unified memory

LPDDR5 Speed

10667 MT/s

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

32 GB

115.2 GB/s

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

170 GB/s

Yes

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

External Display Standard

DisplayPort 1.4 over Thunderbolt 4; HDMI

GPU Name

Apple M6 12-core GPU

Hardware-accelerated ray tracing

Supported

Max External Display Resolution

Up to 8K at 60Hz or 5K at 120Hz or 4K at 240Hz

Video Decode

H.264, HEVC, ProRes, ProRes RAW, AV1

Video Encode

H.264, HEVC, ProRes, ProRes RAW

Intel® Graphics

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

2000 MHz

GPU Max Dynamic Frequency

300 MHz

Graphics Base Frequency

Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.

Graphics Core Count

4 Xe-cores

Execution Units

The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.

Max Resolution

Up to 8K at 60Hz or 5K at 120Hz or 4K at 240Hz

Number of Displays Supported

Media Engine

Hardware-accelerated H.264, HEVC, ProRes and ProRes RAW; AV1 decode

Video Decode Engines

Video Encode Engines

ProRes Encode/Decode Engines