Intel Core Ultra 7 255H
vs
Qualcomm Snapdragon X2 Plus X2P-42-100
vs
CPU Comparison Result
Below are the results of a comparison of
Intel Core Ultra 7 255H
and
Qualcomm Snapdragon X2 Plus X2P-42-100
processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- More Total Cores: 16 (16 vs 6)
- Newer Launch Date: January 2026 (January 2025 vs January 2026)
Basic
Intel
Label Name
Qualcomm
January 2025
Launch Date
January 2026
Laptop
Platform
Laptop
-
CPU Architecture
ARM64-Compatible
-
CPU Name
3rd Gen Qualcomm Oryon CPU
-
Part Number
X2P-42-100
255H
Model Name
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Qualcomm Snapdragon X2 Plus X2P-42-100
Arrow Lake
Code Name
-
CPU Specifications
-
Boost Frequency
4.0 GHz Single-Core
-
Prime-core Multi-Core Max Frequency
4.0 GHz
-
Prime-cores
6
16
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
6
16
Total Threads
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
-
6
Performance-cores
-
10
Efficient-cores
-
2.0 GHz
Performance-core Base Frequency
-
1.5 GHz
Efficient-core Base Frequency
-
5.1 GHz
Performance-core Max Turbo Frequency
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
-
112 K per core
L1 Cache
-
2 MB per core
L2 Cache
-
24 MB shared
L3 Cache
-
100 MHz
Bus Frequency
-
-
Cache
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
22 MB
FCBGA-2049
CPU Socket
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
-
20
Multiplier
-
No
Unlocked Multiplier
-
3 nm
Technology
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
3nm
20-28 W
TDP
-
110 °C
Max. Operating Temperature
Junction Temperature is the maximum temperature allowed at the processor die.
-
5.0
PCIe Version
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
-
x86-64
Instruction Set
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
-
Memory Specifications
-
Memory Bus Width
128-bit
LPDDR5-8400,LPDDR5x-8400,DDR5-6400
Memory Type
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
LPDDR5x
128 GB
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
128 GB
2
Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
-
-
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
152 GB/s
-
Maximum Memory Speed
9523 MT/s
No
ECC Memory Support
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
-
GPU Specifications
-
Display Processing Unit
Qualcomm Adreno DPU
-
External Display Standard
DisplayPort 2.1
-
GPU Name
Qualcomm Adreno GPU
-
GPU Part Number
X2-45
-
Max External Display Resolution
3 displays at up to 4K at 144 Hz or 5K at 60 Hz
-
Max On-Device Display Resolution
4K at 144 Hz
-
On-Device Display Standard
Embedded DisplayPort (eDP) 1.5
-
Video Concurrency
UHD at 60 FPS Encode + 8K at 30 FPS Decode
-
Video Decode
AV1, HEVC, AVC: 8K at 60 FPS
-
Video Encode
HEVC, AVC: 8K UHD at 30 FPS; AV1: 8K UHD at 15 FPS, UHD at 60 FPS
-
Video Processing Unit
Qualcomm Adreno VPU
Intel® Arc™ 140T GPU
Integrated Graphics Model
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
-
2250 MHz
GPU Max Dynamic Frequency
-
-
Graphics Frequency
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
0.9 GHz
-
GPU APIs
DirectX 12.2 Ultimate, Vulkan 1.4, OpenCL 3.0
AI Specifications
-
Micro NPU
Dual Micro NPU on the Qualcomm Sensing Hub
-
NPU Name
Qualcomm Hexagon NPU
-
NPU Performance
80 TOPS (INT8)
Connectivity
-
Bluetooth Connection Technology
Bluetooth LE
-
Bluetooth Version
Bluetooth 5.4
-
Cellular Bandwidth
Up to 1000 MHz (5G)
-
Cellular Modem
Snapdragon X75 5G Modem-RF System
-
Cellular Peak Download Speed
Up to 10 Gbps
-
Cellular Peak Upload Speed
Up to 3.5 Gbps
-
Wi-Fi Bands
6 GHz, 5 GHz, 2.4 GHz
-
Wi-Fi Standard
Wi-Fi 7 (802.11be), 802.11ax, 802.11ac, 802.11n, 802.11g, 802.11b, 802.11a
-
Wireless System
Qualcomm FastConnect 7800 System
Interfaces and Ports
-
PCIe Gen 4.0 Lanes
4
-
PCIe Gen 5.0 Lanes
8
-
SD Standard
SDUC with SD Express, SDXC with UHS-I
-
UFS Version
4.0
-
USB Interface Type
3x USB-C
-
USB Version
USB4 (40 Gbps)
28
PCIe Lanes
-
Miscellaneous
-
Always Sensing
Supported
-
Audio Technology
Qualcomm Aqstic Audio Codec, Qualcomm aptX Audio Technology
-
Dual Camera Support
Up to 36 MP
-
Image Signal Processor
Qualcomm Spectra ISP
-
ISP Bit Width
Dual 18-bit ISPs
-
Out-of-Band Manageability
Out-of-Band Management via Cellular & Wi-Fi, Snapdragon Guardian Technology
-
Single Camera Support
Up to 36 MP
-
Video Capture
Up to 4K at 30 FPS
Benchmarks
Geekbench 6 Single Core
Core Ultra 7 255H
2640
Snapdragon X2 Plus X2P-42-100
3238
+23%
Geekbench 6 Multi Core
Core Ultra 7 255H
14716
+23%
Snapdragon X2 Plus X2P-42-100
11957
Geekbench 7 Single Core
Core Ultra 7 255H
2290
Snapdragon X2 Plus X2P-42-100
2719
+19%
Geekbench 7 Multi Core
Core Ultra 7 255H
13722
+9%
Snapdragon X2 Plus X2P-42-100
12550
Passmark CPU Single Core
Core Ultra 7 255H
4631
+14%
Snapdragon X2 Plus X2P-42-100
4056
Passmark CPU Multi Core
Core Ultra 7 255H
28867
+57%
Snapdragon X2 Plus X2P-42-100
18354
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