Home / CPU Comparison / Intel Core Ultra 7 255H or Qualcomm Snapdragon X2 Elite X2E-88-100: What's better?

Intel Core Ultra 7 255H

vs

Qualcomm Snapdragon X2 Elite X2E-88-100

CPU Comparison Result

Below are the results of a comparison of Intel Core Ultra 7 255H and Qualcomm Snapdragon X2 Elite X2E-88-100 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Qualcomm Snapdragon X2 Elite X2E-88-100

More Total Cores: 18 (16 vs 18)
Newer Launch Date: September 2025 (January 2025 vs September 2025)

Basic

Intel

Label Name

Qualcomm

January 2025

Launch Date

September 2025

Laptop

Platform

Laptop

CPU Architecture

ARM64-Compatible

CPU Name

3rd Gen Qualcomm Oryon CPU

Part Number

X2E-88-100

255H

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Qualcomm Snapdragon X2 Elite X2E-88-100

Arrow Lake

Code Name

CPU Specifications

Boost Frequency

4.7 GHz Single-Core / 4.7 GHz Dual-Core

Performance Cores

Performance-core Multi-Core Max Frequency

3.4 GHz

Prime Cores

Prime-core Multi-Core Max Frequency

4.0 GHz

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

2.0 GHz

Performance-core Base Frequency

1.5 GHz

Efficient-core Base Frequency

5.1 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

112 K per core

L1 Cache

2 MB per core

L2 Cache

24 MB shared

L3 Cache

100 MHz

Bus Frequency

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

53 MB

FCBGA-2049

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Multiplier

Unlocked Multiplier

3 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

3nm

20-28 W

TDP

110 °C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

5.0

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

x86-64

Instruction Set

The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.

Memory Specifications

Memory Bus Width

128-bit

LPDDR5-8400,LPDDR5x-8400,DDR5-6400

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

LPDDR5x

128 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

128 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

152 GB/s

Maximum Memory Speed

9523 MT/s

ECC Memory Support

GPU Specifications

Display Processing Unit

Qualcomm Adreno DPU

External Display Standard

DisplayPort 1.4

GPU APIs

DirectX 12.2 Ultimate, Vulkan 1.4, OpenCL 3.0

GPU Name

Qualcomm Adreno GPU

GPU Part Number

X2-90

Max External Display Resolution

3 displays at up to 4K at 144 Hz or 5K at 60 Hz

Max On-Device Display Resolution

4K at 144 Hz

On-Device Display Standard

Embedded DisplayPort (eDP) 1.5

Video Concurrency

8K UHD at 30 FPS Encode + 8K at 60 FPS Decode

Video Decode

AV1, HEVC, AVC: Dual 8K at 60 FPS

Video Encode

HEVC, AVC: Dual 8K UHD at 30 FPS; AV1: 8K UHD at 15 FPS, UHD at 60 FPS

Video Processing Unit

Qualcomm Adreno VPU

true

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

2250 MHz

GPU Max Dynamic Frequency

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

1.70 GHz

AI Specifications

Micro NPU

Dual Micro NPU on the Qualcomm Sensing Hub

NPU Name

Qualcomm Hexagon NPU

NPU Performance

80 TOPS (INT8)

Connectivity

Bluetooth Connection Technology

Bluetooth LE

Bluetooth Version

Bluetooth 5.4

Cellular Bandwidth

Up to 1000 MHz (5G)

Cellular Modem

Snapdragon X75 5G Modem-RF System

Cellular Peak Download Speed

Up to 10 Gbps

Cellular Peak Upload Speed

Up to 3.5 Gbps

Wi-Fi Bands

6 GHz, 5 GHz, 2.4 GHz

Wi-Fi Standard

Wi-Fi 7 (802.11be), 802.11ax, 802.11ac, 802.11n, 802.11g, 802.11b, 802.11a

Wireless System

Qualcomm FastConnect 7800 System

Interfaces and Ports

NVMe Support

Supported via Dual PCIe 5.0

PCIe Gen 4.0 Lanes

PCIe Gen 5.0 Lanes

SD Standard

SDUC with SD Express, SDXC with UHS-I

UFS Version

4.0

USB Interface Type

3x USB-C

USB Version

USB4 (40 Gbps)

PCIe Lanes

Miscellaneous

Always Sensing

Supported

Audio Technology

Qualcomm Aqstic Audio Codec, Qualcomm aptX Audio Technology

Dual Camera Support

Up to 36 MP

Image Signal Processor

Qualcomm Spectra ISP

ISP Bit Width

Dual 18-bit ISPs

Out-of-Band Manageability

Out-of-Band Management via Cellular & Wi-Fi

Single Camera Support

Up to 36 MP

Video Capture

Up to 4K, 30 FPS