Qualcomm Snapdragon X2 Elite X2E-88-100
vs
Intel Core Ultra X9 388H
vs
CPU Comparison Result
Below are the results of a comparison of
Qualcomm Snapdragon X2 Elite X2E-88-100
and
Intel Core Ultra X9 388H
processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- More Total Cores: 18 (18 vs 16)
- Higher Technology: 2 nm (3nm vs 2 nm)
- Newer Launch Date: January 2026 (September 2025 vs January 2026)
Basic
Qualcomm
Label Name
Intel
September 2025
Launch Date
January 2026
Laptop
Platform
Laptop
ARM64-Compatible
CPU Architecture
-
3rd Gen Qualcomm Oryon CPU
CPU Name
-
X2E-88-100
Part Number
-
Qualcomm Snapdragon X2 Elite X2E-88-100
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
388H
-
Code Name
Panther Lake
CPU Specifications
4.7 GHz Single-Core / 4.7 GHz Dual-Core
Boost Frequency
-
6
Performance Cores
-
3.4 GHz
Performance-core Multi-Core Max Frequency
-
12
Prime Cores
-
4.0 GHz
Prime-core Multi-Core Max Frequency
-
18
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
16
-
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
16
-
Performance-cores
4
-
Efficient-cores
12
-
Performance-core Base Frequency
2.2 GHz
-
Efficient-core Base Frequency
1.7 GHz
-
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
5.1 GHz
-
L1 Cache
112 K per core
-
L2 Cache
3 MB per core
-
L3 Cache
18 MB shared
-
Bus Frequency
100 MHz
53 MB
Cache
?
CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
-
-
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FCBGA-2049
-
Multiplier
22
-
Unlocked Multiplier
No
3nm
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
2 nm
-
TDP
45
-
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
110 °C
-
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
5.0
-
Instruction Set
?
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
x86-64
Memory Specifications
128-bit
Memory Bus Width
-
LPDDR5x
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
LPDDR5-8400,LPDDR5x-8400,DDR5-6400
128 GB
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
128 GB
-
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
152 GB/s
Max Memory Bandwidth
?
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
137 GB/s
9523 MT/s
Maximum Memory Speed
-
-
ECC Memory Support
No
GPU Specifications
Qualcomm Adreno DPU
Display Processing Unit
-
DisplayPort 1.4
External Display Standard
-
DirectX 12.2 Ultimate, Vulkan 1.4, OpenCL 3.0
GPU APIs
-
Qualcomm Adreno GPU
GPU Name
-
X2-90
GPU Part Number
-
3 displays at up to 4K at 144 Hz or 5K at 60 Hz
Max External Display Resolution
-
4K at 144 Hz
Max On-Device Display Resolution
-
Embedded DisplayPort (eDP) 1.5
On-Device Display Standard
-
8K UHD at 30 FPS Encode + 8K at 60 FPS Decode
Video Concurrency
-
AV1, HEVC, AVC: Dual 8K at 60 FPS
Video Decode
-
HEVC, AVC: Dual 8K UHD at 30 FPS; AV1: 8K UHD at 15 FPS, UHD at 60 FPS
Video Encode
-
Qualcomm Adreno VPU
Video Processing Unit
-
-
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
true
-
GPU Base Frequency
800 MHz
-
GPU Max Dynamic Frequency
2300 MHz
1.70 GHz
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
-
-
Execution Units
?
The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.
12
AI Specifications
Dual Micro NPU on the Qualcomm Sensing Hub
Micro NPU
-
Qualcomm Hexagon NPU
NPU Name
-
80 TOPS (INT8)
NPU Performance
-
Connectivity
Bluetooth LE
Bluetooth Connection Technology
-
Bluetooth 5.4
Bluetooth Version
-
Up to 1000 MHz (5G)
Cellular Bandwidth
-
Snapdragon X75 5G Modem-RF System
Cellular Modem
-
Up to 10 Gbps
Cellular Peak Download Speed
-
Up to 3.5 Gbps
Cellular Peak Upload Speed
-
6 GHz, 5 GHz, 2.4 GHz
Wi-Fi Bands
-
Wi-Fi 7 (802.11be), 802.11ax, 802.11ac, 802.11n, 802.11g, 802.11b, 802.11a
Wi-Fi Standard
-
Qualcomm FastConnect 7800 System
Wireless System
-
Interfaces and Ports
Supported via Dual PCIe 5.0
NVMe Support
-
4
PCIe Gen 4.0 Lanes
-
12
PCIe Gen 5.0 Lanes
-
SDUC with SD Express, SDXC with UHS-I
SD Standard
-
4.0
UFS Version
-
3x USB-C
USB Interface Type
-
USB4 (40 Gbps)
USB Version
-
-
PCIe Lanes
28
Miscellaneous
Supported
Always Sensing
-
Qualcomm Aqstic Audio Codec, Qualcomm aptX Audio Technology
Audio Technology
-
Up to 36 MP
Dual Camera Support
-
Qualcomm Spectra ISP
Image Signal Processor
-
Dual 18-bit ISPs
ISP Bit Width
-
Out-of-Band Management via Cellular & Wi-Fi
Out-of-Band Manageability
-
Up to 36 MP
Single Camera Support
-
Up to 4K, 30 FPS
Video Capture
-
Benchmarks
Geekbench 6 Single Core
Snapdragon X2 Elite X2E-88-100
3622
+18%
Core Ultra X9 388H
3062
Geekbench 6 Multi Core
Snapdragon X2 Elite X2E-88-100
19006
+7%
Core Ultra X9 388H
17806
Passmark CPU Single Core
Snapdragon X2 Elite X2E-88-100
4778
+7%
Core Ultra X9 388H
4451
Passmark CPU Multi Core
Snapdragon X2 Elite X2E-88-100
41265
+9%
Core Ultra X9 388H
37904
Share in social media
Or Link To Us
<a href="https://cputronic.com/cpu/compare/qualcomm-snapdragon-x2-elite-x2e-88-100-vs-intel-core-ultra-x9-388h" target="_blank">Qualcomm Snapdragon X2 Elite X2E-88-100 vs Intel Core Ultra X9 388H</a>