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Apple M4 10 Cores vs Intel Core i9-12900H

Apple M4 10 Cores

Intel Core i9-12900H

CPU Comparison Result

Below are the results of a comparison of Apple M4 10 Cores and Intel Core i9-12900H processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Apple M4 10 Cores

Higher Technology: 3 nm (3 nm vs Intel 7)
Newer Launch Date: May 2024 (May 2024 vs January 2022)

Intel Core i9-12900H

More Total Cores: 14 (10 vs 14)

Basic

Apple

Label Name

Intel

May 2024

Launch Date

January 2022

Laptop

Platform

Mobile

M4 10 Cores

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

i9-12900H

Apple M4

Code Name

Alder Lake

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

5.00 GHz

4.51 GHz

Performance-core Base Frequency

2.89 GHz

Efficient-core Base Frequency

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

5.00 GHz

Efficient-core Max Turbo Frequency

Maximum E-core turbo frequency derived from Intel® Turbo Boost Technology.

3.80 GHz

192K per core

L1 Cache

16MB shared

L2 Cache

L3 Cache

24 MB

Apple M-Socket

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FCBGA1744

Multiplier

Unlocked Multiplier

3 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

Intel 7

22 W

TDP

45 W

Processor Base Power

The time-averaged power dissipation that the processor is validated to not exceed during manufacturing while executing an Intel-specified high complexity workload at Base Frequency and at the junction temperature as specified in the Datasheet for the SKU segment and configuration.

45 W

Maximum Turbo Power

The maximum sustained (>1s) power dissipation of the processor as limited by current and/or temperature controls. Instantaneous power may exceed Maximum Turbo Power for short durations (<=10ms). Note: Maximum Turbo Power is configurable by system vendor and can be system specific.

115 W

100°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

ARMv9

Instruction Set

The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.

28 billions

Transistor Count

Memory Specifications

LPDDR5X-7500

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

Up to DDR5 4800 MT/s Up to DDR4 3200 MT/s Up to LPDDR5 5200 MT/s Up to LPDDR4x 4267 MT/s

32 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

64 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

120 GB/s

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

ECC Memory Support

GPU Specifications

Apple M4 GPU (10-core)

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

Intel® Iris® Xe Graphics eligible

500 MHz

GPU Base Frequency

1800 MHz

GPU Max Dynamic Frequency

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

1.45 GHz

160

Execution Units

The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.

4.6 TFLOPS

Graphics Performance

Miscellaneous

Intel Deep Learning Boost (Intel DL Boost) on CPU

A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly increases deep learning inference performance over previous generations.

Yes