Apple M1 Pro
vs
AMD Ryzen AI 9 365

vs

CPU Comparison Result

Below are the results of a comparison of Apple M1 Pro and AMD Ryzen AI 9 365 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

  • Higher Technology: TSMC 4nm FinFET (5 nm vs TSMC 4nm FinFET)
  • Newer Launch Date: July 2025 (October 2021 vs July 2025)

Basic

Apple
Label Name
AMD
October 2021
Launch Date
July 2025
Laptop
Platform
Laptop
Apple Firestorm + Apple Icestorm
CPU Architecture
-
Apple M1 Pro
CPU Name
-
T6000
Part Number
-
Apple M1 Pro
Model Name
Ryzen AI 9 365
-
Code Name
Strix Point
TSMC
Foundry
-
Apple M1 series
Generation
4x Zen 5, 6x Zen 5c
-
OS Support
Windows 11 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit

CPU Specifications

10
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
10
10
Total Threads
20
8
Performance-cores
-
2
Efficient-cores
-
-
Basic Frequency
2 GHz
-
Max Turbo Frequency
Up to 5 GHz
2.064 GHz
Efficient-core Max Turbo Frequency
-
NEON
Instruction Set Extensions
-
3.228 GHz
Performance-core Max Turbo Frequency
-
ARMv8-A, NEON
Extended Instruction Set
-
P-cores: 192 KB instruction + 128 KB data per core; E-cores: 128 KB instruction + 64 KB data per core
L1 Cache
-
P-core cluster: 24 MB; E-core cluster: 4 MB
L2 Cache
10 MB
24 MB system level cache
L3 Cache
24 MB
-
CPU Socket
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FP8
5 nm
Technology
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TSMC 4nm FinFET
-
TDP
28W
-
Max. Operating Temperature
Junction Temperature is the maximum temperature allowed at the processor die.
100°C
-
PCI Express Version
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe® 4.0
ARMv8-A
Instruction Set
An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.
-
33.7 billion
Transistor Count
-

Memory Specifications

256-bit
Memory Bus Width
-
Unified LPDDR5-6400
Memory Type
DDR5 (FP8), LPDDR5X (FP8)
LPDDR5-6400
LPDDR5 Speed
-
32 GB
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
256 GB
-
Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
2
200 GB/s
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
-
6400 MT/s
Maximum Memory Speed
2x2R DDR5-5600
-
ECC Memory Support
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
No

GPU Specifications

Apple M1 Pro GPU
GPU Name
-
Multiple streams of 4K and 8K ProRes video
Video Concurrency
-
H.264, HEVC, ProRes, ProRes RAW
Video Decode
-
H.264, HEVC, ProRes, ProRes RAW
Video Encode
-
Apple media engine with ProRes acceleration
Video Processing Unit
-
-
Integrated Graphics Model
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
AMD Radeon™ 880M
1296 MHz
GPU Max Dynamic Frequency
-
389 MHz
Graphics Base Frequency
Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.
-
16
Graphics Core Count
12
-
Graphics Frequency
2900 MHz
Up to 2 external displays
Number of Displays Supported
-
Metal, OpenCL
GPU APIs
-
Up to 5.3 TFLOPS FP32
Graphics Performance
-
Hardware-accelerated H.264, HEVC, ProRes, and ProRes RAW
Media Engine
-
1
Video Decode Engines
-
1
Video Encode Engines
-
1
ProRes Encode/Decode Engines
-
Yes
OpenCL Support
OpenCL (Open Computing Language) is a multi-platform API (Application Programming Interface) for heterogeneous parallel programming.
-

AI Specifications

16-core Apple Neural Engine
AI Engine
-
16
Neural Engine Core Count
-
Apple Neural Engine
NPU Name
-
11 TOPS INT8
NPU Performance
-

Connectivity

Yes
Bluetooth Support
-
Bluetooth 5.0
Bluetooth Version
-
Wi-Fi 6 (802.11ax)
Wi-Fi Standard
-

Interfaces and Ports

Yes, Thunderbolt 4 up to 40 Gb/s
Thunderbolt Support
-
USB4
USB Version
-
Yes, USB4 up to 40 Gb/s
USB4 Support
-

Miscellaneous

Yes, Apple silicon secure boot chain of trust
Hardware-Verified Secure Boot
-
Apple image signal processor
Image Signal Processor
-
-
Official Website
Kernel Integrity Protection, Pointer Authentication Codes, Fast Permission Restrictions
Runtime Anti-Exploitation
-

Benchmarks

Geekbench 6 Single Core
Apple M1 Pro
2386
Ryzen AI 9 365
2544 +7%
Geekbench 6 Multi Core
Apple M1 Pro
12359
Ryzen AI 9 365
12745 +3%
Passmark CPU Single Core
Apple M1 Pro
3795
Ryzen AI 9 365
4089 +8%
Passmark CPU Multi Core
Apple M1 Pro
21934
Ryzen AI 9 365
30885 +41%