Home / CPU Comparison / AMD Ryzen AI 9 365 or AMD Ryzen 7 8845HS: What's better?

AMD Ryzen AI 9 365

vs

AMD Ryzen 7 8845HS

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen AI 9 365 and AMD Ryzen 7 8845HS processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen AI 9 365

More Total Cores: 10 (10 vs 8)
Larger L3 Cache: 24 MB (24 MB vs 16 MB)
Newer Launch Date: July 2025 (July 2025 vs December 2023)

AMD Ryzen 7 8845HS

Higher Max Turbo Frequency: Up to 5.1 GHz (Up to 5 GHz vs Up to 5.1 GHz)

Basic

AMD

Label Name

AMD

July 2025

Launch Date

December 2023

Laptop

Platform

Laptop

Ryzen AI 9 365

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Ryzen 7 8845HS

Strix Point

Code Name

Hawk Point

4x Zen 5, 6x Zen 5c

Generation

Zen 4

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

2 GHz

Basic Frequency

3.8 GHz

Up to 5 GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Up to 5.1 GHz

10 MB

L2 Cache

8 MB

24 MB

L3 Cache

16 MB

FP8

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP7, FP7r2, FP8

Unlocked for Overclocking

AMD`s product warranty does not cover damages caused by overclocking, even when overclocking is enabled via AMD hardware and/or software. GD-26.

TSMC 4nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 4nm FinFET

28W

TDP

45W

100°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

PCIe® 4.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 4.0

Memory Specifications

DDR5 (FP8), LPDDR5X (FP8)

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5 (FP7r2), LPDDR5X (FP7-FP8)

256 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

256 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

2x2R DDR5-5600

Maximum Memory Speed

4x2R DDR5-5600

ECC Memory Support

GPU Specifications

AMD Radeon™ 880M

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ 780M

2900 MHz

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

2700 MHz

Graphics Core Count