Home / CPU Comparison / Apple M1 Max or Intel Core Ultra 7 255H: What's better?

Apple M1 Max

vs

Intel Core Ultra 7 255H

CPU Comparison Result

Below are the results of a comparison of Apple M1 Max and Intel Core Ultra 7 255H processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Apple M1 Max

Larger L3 Cache: 48 MB system level cache (48 MB system level cache vs 24 MB shared)

Intel Core Ultra 7 255H

More Total Cores: 16 (10 vs 16)
Higher Performance-core Max Turbo Frequency: 5.1 GHz (3.228 GHz vs 5.1 GHz)
Higher Technology: 3 nm (5 nm vs 3 nm)
Newer Launch Date: January 2025 (October 2021 vs January 2025)

Basic

Apple

Label Name

Intel

October 2021

Launch Date

January 2025

Laptop

Platform

Laptop

Apple Firestorm + Apple Icestorm

CPU Architecture

Apple M1 Max

CPU Name

Apple M1 Max

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

255H

Code Name

Arrow Lake

TSMC

Foundry

Apple M1 series

Generation

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

Performance-core Base Frequency

2.0 GHz

Efficient-core Base Frequency

1.5 GHz

2.064 GHz

Efficient-core Max Turbo Frequency

Maximum E-core turbo frequency derived from Intel® Turbo Boost Technology.

NEON

Instruction Set Extensions

3.228 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

5.1 GHz

ARMv8-A, NEON

Extended Instruction Set

P-cores: 192 KB instruction + 128 KB data per core; E-cores: 128 KB instruction + 64 KB data per core

L1 Cache

112 K per core

P-core cluster: 24 MB; E-core cluster: 4 MB

L2 Cache

2 MB per core

48 MB system level cache

L3 Cache

24 MB shared

Bus Frequency

100 MHz

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FCBGA-2049

Multiplier

Unlocked Multiplier

5 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

3 nm

TDP

20-28 W

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

110 °C

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

5.0

ARMv8-A

Instruction Set

The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.

x86-64

57 billion

Transistor Count

Memory Specifications

512-bit

Memory Bus Width

Unified LPDDR5-6400

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

LPDDR5-8400,LPDDR5x-8400,DDR5-6400

LPDDR5-6400

LPDDR5 Speed

64 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

128 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

400 GB/s

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

6400 MT/s

Maximum Memory Speed

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

Thunderbolt 4, HDMI

External Display Standard

Apple M1 Max GPU

GPU Name

Up to three 6K 60Hz displays plus one 4K 60Hz display

Max External Display Resolution

Multiple streams of 4K and 8K ProRes video

Video Concurrency

H.264, HEVC, ProRes, ProRes RAW

Video Decode

H.264, HEVC, ProRes, ProRes RAW

Video Encode

Apple media engine with ProRes acceleration

Video Processing Unit

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

Intel® Arc™ 140T GPU

1296 MHz

GPU Max Dynamic Frequency

2250 MHz

389 MHz

Graphics Base Frequency

Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.

Graphics Core Count

Up to 4 external displays

Number of Displays Supported

Metal, OpenCL

GPU APIs