AMD Ryzen AI 9 365
vs
Intel Core Ultra 7 255H

vs

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen AI 9 365 and Intel Core Ultra 7 255H processors based on key performance characteristics, as well as power consumption and much more.

Advantages

  • Newer Launch Date: July 2025 (July 2025 vs January 2025)
  • More Total Cores: 16 (10 vs 16)
  • Higher Technology: 3 nm (TSMC 4nm FinFET vs 3 nm)

Basic

AMD
Label Name
Intel
July 2025
Launch Date
January 2025
Laptop
Platform
Laptop
Ryzen AI 9 365
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
255H
Strix Point
Code Name
Arrow Lake
4x Zen 5, 6x Zen 5c
Generation
-

CPU Specifications

10
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
16
20
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
16
-
Performance-cores
6
-
Efficient-cores
10
2 GHz
Basic Frequency
-
Up to 5 GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
-
-
Performance-core Base Frequency
2.0 GHz
-
Efficient-core Base Frequency
1.5 GHz
-
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
5.1 GHz
-
L1 Cache
112 K per core
10 MB
L2 Cache
2 MB per core
24 MB
L3 Cache
24 MB shared
FP8
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FCBGA-2049
-
Bus Frequency
100 MHz
-
Multiplier
20
-
Unlocked Multiplier
No
TSMC 4nm FinFET
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
3 nm
28W
TDP
20-28 W
100°C
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
110 °C
-
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
5.0
PCIe® 4.0
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
-
-
Instruction Set
?
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
x86-64

Memory Specifications

DDR5 (FP8), LPDDR5X (FP8)
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
LPDDR5-8400,LPDDR5x-8400,DDR5-6400
256 GB
Max Memory Size
?
Max memory size refers to the maximum memory capacity supported by the processor.
128 GB
2
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
2x2R DDR5-5600
Maximum Memory Speed
-
No
ECC Memory Support
No

GPU Specifications

AMD Radeon™ 880M
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
true
-
GPU Max Dynamic Frequency
2250 MHz
2900 MHz
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
-
12
Graphics Core Count
-

Miscellaneous

Official Website
-
-
PCIe Lanes
28
Windows 11 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit
OS Support
-

Benchmarks

Geekbench 6 Single Core
Ryzen AI 9 365
2544
Core Ultra 7 255H
2640 +4%
Geekbench 6 Multi Core
Ryzen AI 9 365
12745
Core Ultra 7 255H
14716 +15%
Passmark CPU Single Core
Ryzen AI 9 365
4089
Core Ultra 7 255H
4631 +13%
Passmark CPU Multi Core
Ryzen AI 9 365
30885 +7%
Core Ultra 7 255H
28867