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AMD Ryzen AI 9 HX 370

vs

Qualcomm Snapdragon X Elite

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen AI 9 HX 370 and Qualcomm Snapdragon X Elite processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen AI 9 HX 370

Newer Launch Date: July 2025 (July 2025 vs October 2023)

Qualcomm Snapdragon X Elite

Larger L3 Cache: 42MB (24 MB vs 42MB)

Basic

AMD

Label Name

Qualcomm

July 2025

Launch Date

October 2023

Laptop

Platform

Laptop

Ryzen AI 9 HX 370

Model Name

X1E-84-100

Strix Point

Code Name

Oryon

Foundry

Samsung TSMC

4x Zen 5, 8x Zen 5c

Generation

Oryon

Windows 11 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit

OS Support

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Performance-cores

2 GHz

Basic Frequency

Up to 5.1 GHz

Max Turbo Frequency

Performance-core Base Frequency

3.8 GHz

Performance-core Max Turbo Frequency

4.2 GHz

12 MB

L2 Cache

24 MB

L3 Cache

42MB

Bus Frequency

100MHz

FP8

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Unlocked Multiplier

TSMC 4nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

4 nm

28W

TDP

23-65 W

100°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

PCIe® 4.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

4.0

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

4.0

Instruction Set

An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.

Arm-64

Memory Specifications

DDR5 (FP8), LPDDR5X (FP8)

Memory Type

LPDDR5x-8448

256 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

64GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

135 GB/s

2x2R DDR5-5600

Maximum Memory Speed

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

GPU Name

Qualcomm Adreno

AMD Radeon™ 890M

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

Graphics Core Count

2900 MHz

Graphics Frequency

Graphics Performance

4.6 TFLOPS