Home / CPU Comparison / AMD Ryzen AI 5 330 or Qualcomm Snapdragon X X1-26-100: What's better?

AMD Ryzen AI 5 330

vs

Qualcomm Snapdragon X X1-26-100

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen AI 5 330 and Qualcomm Snapdragon X X1-26-100 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen AI 5 330

Newer Launch Date: July 2025 (July 2025 vs January 2025)

Qualcomm Snapdragon X X1-26-100

More Total Cores: 8 (4 vs 8)

Basic

AMD

Label Name

Qualcomm

July 2025

Launch Date

January 2025

Laptop

Platform

Laptop

CPU Architecture

64-bit architecture

CPU Name

Qualcomm Oryon CPU

Part Number

X1-26-100

Ryzen AI 5 330

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Qualcomm Snapdragon X X1-26-100

Krackan Point

Code Name

1x Zen 5, 3x Zen 5c

Generation

Windows 11 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit

OS Support

CPU Specifications

Boost Frequency

None

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

2 GHz

Basic Frequency

Up to 4.5 GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

4 MB

L2 Cache

8 MB

L3 Cache

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

30 MB

FP8

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

TSMC 4nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

4nm

28W

TDP

100°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

PCIe® 4.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Memory Specifications

Memory Bus Width

16-bit x 8 channels

DDR5 (FP8), LPDDR5X (FP8)

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

LPDDR5x

256 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

64 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

135 GB/s

4x2R LPDDR5x-8000, DDR5-5600

Maximum Memory Speed

8448 MT/s

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

Display Processing Unit

Adreno DPU

External Display Standard

DisplayPort 1.4

GPU Name

Qualcomm Adreno GPU

Max External Display Resolution

3 displays up to UHD 60 Hz HDR10; 2 displays up to 5K 60 Hz or UHD 120 Hz

Max On-Device Display Resolution

Up to QHD+ 120 Hz HDR10

On-Device Display Standard

eDP v1.4b

Video Concurrency

4K 30 FPS 8-bit decode + 1080p 30 FPS encode; 1080p 60 FPS 10-bit decode + 1080p 30 FPS encode

Video Decode

4K 30 FPS 10-bit playback: HEVC, VP9, AV1; 4K 60 FPS 8-bit playback: H.264, HEVC

Video Encode

4K UHD 30 FPS 8-bit recording: H.264, HEVC, AV1

Video Processing Unit

Adreno VPU

AMD Radeon™ 820M

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

Graphics Core Count

2800 MHz

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

Graphics Performance

1.7 TFLOPS