AMD Ryzen AI 5 330

AMD Ryzen AI 5 330

AMD Ryzen AI 5 330 — an entry-level mobile APU with a 50-TOPS NPU

A compact, entry-level mobile processor for the Copilot+ PC platform. It combines 4 cores/8 threads on Zen 5/Zen 5c, a simple integrated Radeon 820M GPU, and a built-in XDNA 2 NPU rated up to 50 TOPS. It targets thin-and-light laptops and mini-PCs with a focus on efficiency and on-device AI scenarios.

Key specifications

  • Architecture / codename, process node: hybrid Zen 5 + Zen 5c; Ryzen AI 300 family (mobile APU generation); 4 nm node.

  • Cores / threads: 4 / 8 (1 performance Zen 5 and 3 efficiency-oriented Zen 5c; SMT enabled).

  • Frequencies (base; boost): ~2.0 GHz; up to ~4.5 GHz (actual values depend on power/thermal profiles).

  • L3 cache: 8 MB (L2 — 4 MB).

  • Power envelope: default TDP 28 W; cTDP range 15–28 W.

  • Integrated graphics: Radeon 820M (RDNA 3.5), 2 CU / 128 ALUs; aimed at basic 2D/video workloads and light 1080p gaming.

  • Memory: dual-channel DDR5-5600 or LPDDR5X-8000; a full dual-channel configuration is critical.

  • Interfaces: 14 native PCIe 4.0 lanes (allocation varies by OEM), USB4 (up to 40 Gbps, typically 2 ports), USB 3.2 Gen 2 (10 Gbps), output to up to four displays via USB-C (DP Alt Mode)/HDMI depending on implementation.

  • NPU / Ryzen AI: XDNA 2, up to 50 TOPS INT8; enables on-device features (including Copilot+ PC functions in Windows).

  • Optional: performance positioning: below Ryzen AI 5 340/AI 7 350 in multi-thread and graphics; single-thread performance can be close to Zen 5 levels of higher SKUs at similar clocks.

What this chip is and where it fits

Ryzen AI 5 330 is the most affordable member of the Ryzen AI 300 lineup for mobile. The model is intended for mainstream thin laptops, budget Copilot+ systems, and compact mini-PCs where long battery life, quiet operation, and baseline on-device AI capabilities matter. Within the 300-series hierarchy it sits below Ryzen AI 5 340, Ryzen AI 7 350, and AI 9 SKUs, emphasizing cost and efficiency.

Architecture and process

The die uses a hybrid layout: performance Zen 5 cores are paired with efficiency-focused Zen 5c cores. This allows task-type scheduling: peak single-thread bursts on the larger cores, sustained background or service workloads on the compact ones. The cache subsystem includes 4 MB of L2 (1 MB per core) and 8 MB of shared L3 — sufficient for desktop apps, heavy browser use, IDEs, and office suites at the entry tier.

The multimedia blocks support modern video codecs up to AV1 (hardware decode), along with HEVC and H.264; hardware encode capabilities depend on the iGPU media engines, but everyday streaming and video calls are covered. The memory controller supports both socketed DDR5 and high-speed LPDDR5X — the trade-off between latency and bandwidth depends on platform goals and the notebook’s design.

CPU performance

In day-to-day workloads — office apps, browsers with dozens of tabs, video conferencing, light development and builds of smaller projects, simple photo tasks — Ryzen AI 5 330 delivers snappy behavior via Zen 5 IPC and boost clocks up to ~4.5 GHz. In heavily parallel scenarios (large-scale rendering, very big codebases, multi-threaded archiving), four cores/eight threads become the limiting factor; acceleration is bounded by the core count and TDP.

A practical note: results scale with the thermal package and cooling system. In chassis holding TDP at 15–18 W, sustained clocks under long load will be lower than in designs configured at 25–28 W with more robust heatpipes. This primarily affects lengthy batch jobs: the better the cooling and the higher the power limit, the closer sustained performance gets to short-term peaks.

Graphics and multimedia (iGPU)

The integrated Radeon 820M (RDNA 3.5, 2 CU/128 ALUs) targets UI acceleration, media playback, and basic graphics. For games, think 1080p on low/occasionally medium presets in lighter and competitive titles, with wide variation by game and settings. For AAA titles and high presets, a discrete GPU or higher-tier AI 300 APU with more CUs is preferable.

Memory bandwidth strongly affects the iGPU: dual-channel LPDDR5X-8000 delivers better frame pacing than DDR5-5600, though final results depend on timings, controller behavior, and power limits. For media, AV1/HEVC/H.264 hardware decode ensures smooth 4K streaming with low power draw.

AI / NPU

The built-in XDNA 2 NPU rated up to 50 TOPS accelerates on-device AI: speech transformations (captions, noise suppression), video effects (background blur, auto-framing), on-device object recognition, metadata generation, and local inference for moderate-size models. The NPU offloads CPU/GPU, reduces power in those tasks, and satisfies Copilot+ PC requirements. NPU capability is consistent across the Ryzen AI 300 family, simplifying developer targeting.

Platform and I/O

A typical mobile platform around Ryzen AI 5 330 provides:

  • PCIe: 14 native lanes of PCIe 4.0. OEMs split them between NVMe storage and, where present, discrete graphics or high-speed controllers; exact routing varies by device.

  • USB/Thunderbolt: native USB4 (up to 40 Gbps), commonly two fully featured USB-C ports with DP Alt Mode and Power Delivery; plus USB 3.2 Gen 2 (10 Gbps). Thunderbolt interoperability depends on system-level certification.

  • Displays: up to four independent outputs (combinations of USB-C/DP Alt Mode and HDMI), subject to the notebook or mini-PC implementation.

  • Networking & storage: typically Wi-Fi 6E/7 via the OEM’s module, one or two M.2 2280 (PCIe 4.0 ×4) for NVMe, sometimes a card reader slot.

Power consumption and cooling

With a 15–28 W cTDP range and a compact die, the 330 is tailored to slim chassis. In “Balanced”/“Silent” profiles it maintains low temperatures and noise at the expense of sustained performance; in “Performance” profiles sustained clocks are higher but cooling becomes the priority. With sensible fan curves and a competent heatpipe, the CPU avoids pronounced frequency “sawtoothing” under long loads.

Where it appears

Expect Ryzen AI 5 330 in mainstream 13–15-inch entry-level laptops, education and office-oriented models, and compact mini-PCs focused on office work, multimedia, light development, and everyday tasks. Specific series and timelines depend on OEMs.

Comparison and positioning

  • Versus Ryzen AI 5 340: the 340 brings 6 cores/12 threads and Radeon 840M (4 CU), clearly boosting multi-threaded and graphics performance. NPU is the same (50 TOPS); TDP is similar. The 330 trades raw throughput for lower cost and simpler graphics/core counts.

  • Versus Ryzen AI 7 350: 8 cores/16 threads and a stronger iGPU (860M, 8 CU) move the 350 into a different class for rendering, encoding, and gaming. The power envelope is comparable, with greater cooling demands.

  • Versus Ryzen AI 9 (365/370/HX): double-digit core counts, higher boosts, and large iGPUs (880M/890M) define the premium tier. The 330 is the baseline entry to Copilot+ PCs, optimized for efficiency and value.

Who it suits

  • Office and study: documents, spreadsheets, presentations, video calls, note-taking with local transcription — with long battery life.

  • Browsing and everyday tasks: heavy tab use, mail, messaging, online services.

  • Light development and automation: IDE work, builds for small/medium projects, local scripts; for CI with very high parallelism, higher SKUs are advisable.

  • Multimedia: 4K playback, basic clip editing, format conversion without strict deadlines.

  • Entry-level gaming: lighter titles at 1080p on low/medium settings; for AAA or high FPS, aim for a dGPU or higher APU.

Pros and cons

Pros

  • XDNA 2 NPU at 50 TOPS — same AI acceleration level as higher AI 300 models.

  • Modern I/O (USB4, 14 lanes of PCIe 4.0), support for up to four displays.

  • Strong efficiency with a wide 15–28 W cTDP span.

  • Support for fast LPDDR5X memory and hardware AV1 decode.

Cons

  • Only 4 cores/8 threads limit heavily parallel workloads.

  • Radeon 820M with 2 CUs is the minimal 3D tier in the family.

  • Sustained clocks depend noticeably on cooling and power limits.

  • I/O routing and port speeds vary with each notebook design.

Configuration recommendations

  • Memory: strictly dual-channel; for iGPU, prefer LPDDR5X-7500/8000. Capacity — at least 16 GB; 32 GB gives headroom for IDEs, browsers, and media apps.

  • Storage: NVMe PCIe 4.0 ×4; for working datasets, consider two M.2 drives (system + data/cache).

  • Cooling: prioritize designs with a mid-sized fan and heatpipe; “Balanced/Performance” profiles with sensible curves help sustain clocks in long jobs.

  • Power modes: on AC, use “Performance” and allow higher power limits within 25–28 W; on battery, “Balanced” extends runtime with modest performance trade-offs.

  • Graphics/displays: for multi-monitor use, ensure two USB4 ports with DP Alt Mode; for occasional editing and encode offload, lean on AV1/HEVC paths where hardware engines are most efficient.

Summary

Ryzen AI 5 330 is a cost-effective entry to the Copilot+ PC ecosystem: modern Zen 5/Zen 5c architecture, a platform-standard 50-TOPS NPU, and a basic iGPU adequate for UI, video, and light gaming. For heavy multi-thread and 3D workloads, AI 5 340/AI 7 350 with more cores and CUs are better fits, but in compact and affordable laptops the 330 strikes the needed balance of efficiency, contemporary I/O, and on-device AI capability. When priorities are battery life, office/browsing/media, and local AI features, this processor fits the brief; for intensive rendering, wide parallel builds, or high-end gaming, choose a higher-tier SKU or add a discrete GPU.

Basic

Label Name
AMD
Platform
Laptop
Launch Date
July 2025
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Ryzen AI 5 330
Code Name
Krackan Point 2
Foundry
TSMC
Generation
Ryzen AI (Zen 5)

CPU Specifications

Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
4
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
8
Performance-core Base Frequency
2 GHz
Efficient-core Base Frequency
2000 MHz
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
4.5 GHz
L1 Cache
80 KB per core
L2 Cache
1 MB per core (4MB total)
L3 Cache
8 MB
Bus Frequency
100 MHz
Multiplier
20.0
Unlocked Multiplier
No
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
AMD Socket FP8
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
4 nm
TDP
28 W
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
100°C
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
4

Memory Specifications

Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
LPDDR5x-8000, DDR5-5600
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
ECC Memory Support
No

GPU Specifications

Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
Radeon 820M
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
2800 MHz
Graphics Core Count
2
DirectX Support
?
DirectX* Support indicates support for a specific version of Microsoft’s collection of APIs (Application Programming Interfaces) for handling multimedia compute tasks.
12
Max Resolution
7680x4320 @ 60Hz , 3840x2160 @ 240Hz , 3440x1440 @ 360Hz , 2560x1440 @ 480Hz , 1920x1080 @ 600Hz
Number of Displays Supported
4

Miscellaneous

PCIe Lanes
14

Benchmarks

Geekbench 6
Single Core Score
2131
Geekbench 6
Multi Core Score
7079

Compared to Other CPU

Geekbench 6 Single Core
2314 +8.6%
2207 +3.6%
2034 -4.6%
1934 -9.2%
Geekbench 6 Multi Core
8035 +13.5%
7510 +6.1%
6673 -5.7%
6311 -10.8%