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AMD Ryzen 9 7945HX vs Apple M3 Max

AMD Ryzen 9 7945HX

Apple M3 Max

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 9 7945HX and Apple M3 Max processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Apple M3 Max

Higher Technology: 3 nm (TSMC 5nm FinFET vs 3 nm)
Newer Launch Date: October 2023 (January 2023 vs October 2023)

Basic

AMD

Label Name

Apple

January 2023

Launch Date

October 2023

Laptop

Platform

Laptop

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

M3 Max

Dragon Range

Code Name

Apple M3

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

2.5GHz

Basic Frequency

Up to 5.4GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Performance-core Base Frequency

3.6 GHz

Efficient-core Base Frequency

2.48 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

4.05 GHz

1024KB

L1 Cache

192K per core

16MB

L2 Cache

32MB

64MB

L3 Cache

Yes

Unlocked for Overclocking

AMD`s product warranty does not cover damages caused by overclocking, even when overclocking is enabled via AMD hardware and/or software. GD-26.

FL1

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Apple M-Socket

TSMC 5nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

3 nm

55W

TDP

30 W

100°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

PCIe® 5.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Memory Specifications

DDR5

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

LPDDR5-6400

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

128GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

GPU Specifications

AMD Radeon™ 610M

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

True

2200 MHz

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

Graphics Core Count

Miscellaneous

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit *Operating System (OS) support will vary by manufacturer.

OS Support