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AMD Ryzen 9 5980HX vs Apple M3 Pro

AMD Ryzen 9 5980HX

Apple M3 Pro

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 9 5980HX and Apple M3 Pro processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Apple M3 Pro

More Total Cores: 12 (8 vs 12)
Higher Technology: 3 nm (TSMC 7nm FinFET vs 3 nm)
Higher Memory Type: LPDDR5-6400 (DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s vs LPDDR5-6400)
Newer Launch Date: October 2023 (January 2021 vs October 2023)

Basic

AMD

Label Name

Apple

January 2021

Launch Date

October 2023

Laptop

Platform

Laptop

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

M3 Pro

Code Name

Apple M3

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Performance-cores

Efficient-cores

3.3GHz

Basic Frequency

Up to 4.8GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Performance-core Base Frequency

3.6 GHz

Efficient-core Base Frequency

2.48 GHz

Performance-core Max Turbo Frequency

Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.

4.05 GHz

L1 Cache

192K (per core)

4MB

L2 Cache

16MB (shared)

16MB

L3 Cache

FP6

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Apple M-Socket

TSMC 7nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

3 nm

45+W

TDP

30 W

105°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

PCIe® 3.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Memory Specifications

DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

LPDDR5-6400

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

36GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

GPU Specifications

AMD Radeon™ Graphics

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

True

2100 MHz

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

Graphics Core Count