Advantages
- More Total Cores: 8 (8 vs 4)
- Higher Max Turbo Frequency: Up to 4.9 GHz (Up to 4.9 GHz vs 3.6 Ghz)
- Larger L3 Cache: 16 MB (16 MB vs 6 MB shared)
- Higher Technology: TSMC 4nm FinFET (TSMC 4nm FinFET vs 7 nm)
- Newer Launch Date: January 2025 (June 2024 vs January 2025)
Basic
AMD
Label Name
Intel
June 2024
Launch Date
January 2025
Laptop
Platform
Laptop
Ryzen 7 8745HS
Model Name
N150
Hawk Point
Code Name
Twin Lake
Zen 4
Generation
-
Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit
OS Support
-
CPU Specifications
8
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
4
16
Total Threads
4
3.8 GHz
Basic Frequency
-
Up to 4.9 GHz
Max Turbo Frequency
3.6 Ghz
-
L1 Cache
96 K per core
8 MB
L2 Cache
2 MB shared
16 MB
L3 Cache
6 MB shared
-
Bus Frequency
100 MHz
FP7r2, FP8
CPU Socket
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FCBGA1264
-
Multiplier
34x
No
Unlocked for Overclocking
-
-
Unlocked Multiplier
No
TSMC 4nm FinFET
Technology
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
7 nm
45W
TDP
6 W
100°C
Max. Operating Temperature
Junction Temperature is the maximum temperature allowed at the processor die.
105°C
PCIe® 4.0
PCI Express Version
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
-
-
PCIe Version
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
3.0
-
Instruction Set
An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.
x86-64
Memory Specifications
DDR5 (FP7r2), LPDDR5X (FP7-FP8)
Memory Type
DDR5-4800, DDR4-3200, LPDDR5-4800
256 GB
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
16 GB
2
Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
1
-
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
38.4 GB/s
4x2R DDR5-5600
Maximum Memory Speed
-
No
ECC Memory Support
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
No
GPU Specifications
AMD Radeon™ 780M
Integrated Graphics Model
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
Intel® Graphics
-
GPU Max Dynamic Frequency
1000 MHz
12
Graphics Core Count
-
2600 MHz
Graphics Frequency
-
-
Execution Units
24
-
Graphics Performance
0.3 TFLOPS
Interfaces and Ports
-
PCIe Lanes
9
Miscellaneous
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