AMD Ryzen 3 PRO 3300U
About processor
The AMD Ryzen 3 PRO 3300U is an impressive processor that offers excellent performance for laptops. With a 12nm technology, 4 cores, and 4 threads, this processor delivers reliable and efficient multitasking capabilities. The 4MB L3 cache and a low TDP of 15W contribute to its energy efficiency and smooth operation.
One of the most notable features of the Ryzen 3 PRO 3300U is its integrated graphics model, the Radeon™ Vega 6 Graphics. This powerful graphics unit enhances the overall visual experience, making it suitable for light gaming and multimedia tasks.
In terms of performance, the Ryzen 3 PRO 3300U truly shines. With a Geekbench 6 single-core score of 901 and a multi-core score of 2471, this processor demonstrates its ability to handle a wide range of computing tasks with ease.
Overall, the AMD Ryzen 3 PRO 3300U is a compelling choice for those in need of a capable processor for their laptops. Its combination of solid CPU performance and integrated graphics make it a great option for both productivity and entertainment purposes. Whether you're working on demanding projects or enjoying multimedia content, the Ryzen 3 PRO 3300U delivers a smooth and efficient user experience.
Basic
Label Name
AMD
Platform
Laptop
Launch Date
April 2019
Code Name
Picasso
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
4
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
4
Basic Frequency
2.1GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Up to 3.5GHz
L1 Cache
384KB
L2 Cache
2MB
L3 Cache
4MB
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FP5
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
12nm
TDP
15W
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
95°C
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe® 3.0
Memory Specifications
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
Bus Speed
Up to 2400MT/s
GPU Specifications
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
Radeon™ Vega 6 Graphics
Graphics Frequency
?
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.
1200 MHz
Benchmarks
Geekbench 6
Single Core
Score
901
Geekbench 6
Multi Core
Score
2471
Geekbench 5
Single Core
Score
786
Geekbench 5
Multi Core
Score
2252
Passmark CPU
Single Core
Score
1939
Passmark CPU
Multi Core
Score
5972
Compared to Other CPU
Geekbench 6 Single Core
Geekbench 6 Multi Core
Geekbench 5 Single Core
Geekbench 5 Multi Core
Passmark CPU Single Core
Passmark CPU Multi Core