AMD Ryzen 3 5425C
About processor
The AMD Ryzen 3 5425C processor is a powerful and efficient CPU designed for laptops. Built on TSMC's 7nm FinFET technology, this processor features 4 cores and 8 threads, making it capable of handling a wide range of tasks with ease. With a 15W TDP, the Ryzen 3 5425C strikes a great balance between performance and power efficiency, making it an ideal choice for portable devices.
One of the standout features of this processor is its integrated AMD Radeon™ Graphics, which delivers impressive visual performance for a seamless gaming and multimedia experience. The 8MB L3 cache further enhances the overall responsiveness and multitasking capabilities of the CPU.
In terms of performance, the Ryzen 3 5425C does not disappoint. It achieved a Geekbench 6 Single Core score of 1350 and a Multi Core score of 4133, showcasing its ability to handle demanding workloads and deliver smooth multitasking performance.
Overall, the AMD Ryzen 3 5425C processor is a solid choice for laptop users who prioritize performance and efficiency. Whether you're a content creator, a gamer, or a professional on the go, this processor is more than capable of meeting your computing needs.
Basic
Label Name
AMD
Platform
Laptop
Launch Date
May 2022
Code Name
Cezanne-U
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
4
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
8
Basic Frequency
2.7GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Up to 4.1GHz
L1 Cache
256KB
L2 Cache
2MB
L3 Cache
8MB
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FP6
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
TSMC 7nm FinFET
TDP
15W
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
95°C
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe® 3.0
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR4
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
2
GPU Specifications
Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
AMD Radeon™ Graphics
Benchmarks
Geekbench 6
Single Core
Score
1350
Geekbench 6
Multi Core
Score
4133
Geekbench 5
Single Core
Score
1107
Geekbench 5
Multi Core
Score
3576
Compared to Other CPU
Geekbench 6 Single Core
Geekbench 6 Multi Core
Geekbench 5 Single Core
Geekbench 5 Multi Core