AMD EPYC 7302P
About processor
The AMD EPYC 7302P processor is a powerful server CPU that offers impressive performance and efficiency. With 16 total cores and 32 threads, this processor is capable of handling demanding workloads and multitasking with ease. The 128MB L3 cache provides ample space for data storage and retrieval, further enhancing the processor's speed and responsiveness.
One standout feature of the EPYC 7302P is its TDP of 155W, which ensures that the processor delivers high performance without consuming excessive power. This makes it an excellent choice for businesses looking to minimize their energy consumption and reduce their carbon footprint.
In terms of performance, the Geekbench 6 scores are also impressive, with a single-core score of 1088 and a multi-core score of 8100. These scores indicate that the EPYC 7302P excels in both single-threaded and multi-threaded tasks, making it a versatile option for a wide range of server applications.
Overall, the AMD EPYC 7302P processor is an excellent choice for businesses in need of a high-performance server CPU. Its combination of high core count, efficient power consumption, and impressive benchmark scores make it a standout option in the server CPU market.
Basic
Label Name
AMD
Platform
Server
Launch Date
August 2019
Code Name
Rome
CPU Specifications
Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
16
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
32
Basic Frequency
3.0GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
Up to 3.3GHz
L3 Cache
128MB
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
SP3
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
7 nm
TDP
155W
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
PCIe 4.0 x128
Memory Specifications
Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR4
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
8
Bus Speed
Up to 3200MT/s
Benchmarks
Geekbench 6
Single Core
Score
1248
Geekbench 6
Multi Core
Score
9571
Geekbench 5
Single Core
Score
817
Geekbench 5
Multi Core
Score
4759
Passmark CPU
Single Core
Score
1870
Passmark CPU
Multi Core
Score
32612
Compared to Other CPU
Geekbench 6 Single Core
Geekbench 6 Multi Core
Geekbench 5 Single Core
Geekbench 5 Multi Core
Passmark CPU Single Core
Passmark CPU Multi Core