Advantages
- Higher Technology: 4 nm (7 nm vs 4 nm)
- Higher Frequency: 3400 MHz (3200 MHz vs 3400 MHz)
- Newer Launch Date: January 2026 (January 2021 vs January 2026)
Basic
Qualcomm
Label Name
MediaTek
January 2021
Launch Date
January 2026
SmartPhone Flagship
Platform
SmartPhone Mid range
TSMC
Manufacturing
TSMC
SM8250-AC
Model Name
Dimensity 8500
1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)
Architecture
1x 3.4 GHz – Cortex-A725, 3x 3.2 GHz – Cortex-A725, 4x 2.2 GHz – Cortex-A725
8
Cores
8
7 nm
Technology
4 nm
3200 MHz
Frequency
3400 MHz
10.3
Transistor count
-
GPU Specifications
Adreno 650
GPU name
Mali-G720 MС8
670 MHz
GPU frequency
-
1.3721 TFLOPS
FLOPS
-
512
Shading units
128
2
Execution units
-
2.0
OpenCL version
3.2
1.1
Vulkan version
1.3
3840 x 2160
Max display resolution
2960 x 1440
12.1
DirectX version
-
Connectivity
Up to 7500 Mbps
Download speed
-
LTE Cat. 22
4G support
-
Yes
5G support
Yes
5.2
Bluetooth
5.4
6
Wi-Fi
Wi-Fi 6E (a/b/g/n/ac/ax)
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
LPDDR5
Memory type
LPDDR5X
2750 MHz
Memory frequency
4800 MHz
4x 16 Bit
Memory Bus
4x 16 Bit
Miscellaneous
1 MB
L2 Cache
-
AAC, AIFF, CAF, MP3, MP4, WAV
Audio codecs
- AAC LC - FLAC - HE-AACv1 - HE-AACv2 - MP3
1x 200MP, 2x 25MP
Max camera resolution
1x 320MP, 3x 32MP
UFS 3.0, UFS 3.1
Storage type
UFS 4 + MCQ
8K at 30FPS, 4K at 60FPS
Video capture
4K at 60FPS
H.264, H.265, VP8, VP9
Video codecs
- H.264 - H.265 - AV1 - VP9
8K at 30FPS, 4K at 60FPS
Video playback
4K at 60FPS
6 W
TDP
-
ARMv8.2-A
Instruction set
ARMv9.2-A
Hexagon 698
Neural processor (NPU)
MediaTek NPU 880
Benchmarks
Geekbench 6 Single Core
Snapdragon 870
1151
Dimensity 8500
1693
+47%
Geekbench 6 Multi Core
Snapdragon 870
3336
Dimensity 8500
6897
+107%
AnTuTu 10
Snapdragon 870
794278
Dimensity 8500
2359462
+197%
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