Advantages
- Higher Technology: 6 nm (6 nm vs 7 nm)
- Newer Launch Date: July 2025 (May 2021 vs July 2025)
Basic
Qualcomm
Label Name
HiSilicon
May 2021
Launch Date
July 2025
SmartPhone Mid range
Platform
SmartPhone Flagship
SM7325
Model Name
Kirin 9010s
1x 2.4 GHz – Kryo 670 Prime (Cortex-A78)
3x 2.2 GHz – Kryo 670 Gold (Cortex-A78)
4x 1.9 GHz – Kryo 670 Silver (Cortex-A55)
3x 2.2 GHz – Kryo 670 Gold (Cortex-A78)
4x 1.9 GHz – Kryo 670 Silver (Cortex-A55)
Architecture
2 cores x 2.5GHz + 6 cores x 2.05GHz + 4 cores x 1.50GHz
8
Cores
12
6 nm
Technology
7 nm
2400 MHz
Frequency
-
GPU Specifications
Adreno 642L
GPU name
-
490 MHz
GPU frequency
-
384
Shading units
-
2
Execution units
-
2.0
OpenCL version
-
1.1
Vulkan version
-
2520 x 1080
Max display resolution
-
12
DirectX version
-
Connectivity
Up to 1200 Mbps
Download speed
-
LTE Cat. 24
4G support
Yes
5.2
Bluetooth
Bluetooth 5.2, поддержка BLE, SBC, AAC, LDAC и L2HC.
6
Wi-Fi
802.11a/b/g/n/ac/ax/be, 2 × 2 MIMO, EHT160
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
Navigation
-
Memory Specifications
LPDDR5
Memory type
-
3200 MHz
Memory frequency
-
2x 16 Bit
Memory Bus
-
Miscellaneous
2 MB
L2 Cache
-
AAC, AIFF, CAF, MP3, MP4, WAV
Audio codecs
-
1x 192MP, 2x 36MP
Max camera resolution
-
UFS 2.1, UFS 2.2, UFS 3.0, UFS 3.1
Storage type
-
4K at 30FPS
Video capture
-
H.264, H.265, VP8, VP9
Video codecs
-
4K at 30FPS
Video playback
-
5 W
TDP
-
ARMv8.4-A
Instruction set
-
Hexagon 770
Neural processor (NPU)
-
Benchmarks
Geekbench 6 Single Core
Snapdragon 778G
981
Kirin 9010s
1442
+47%
Geekbench 6 Multi Core
Snapdragon 778G
2787
Kirin 9010s
4443
+59%
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