Advantages
- Newer Launch Date: August 2024 (August 2024 vs June 2019)
- Higher Technology: 7 nm (12 nm vs 7 nm)
- Higher Frequency: 2270 MHz (2000 MHz vs 2270 MHz)
Basic
MediaTek
Label Name
HiSilicon
August 2024
Launch Date
June 2019
SmartPhone Low end
Platform
SmartPhone Mid range
TSMC
Manufacturing
-
Helio G81
Model Name
Hi6280
2x 2 GHz – Cortex-A75
6x 1.8 GHz – Cortex-A55
6x 1.8 GHz – Cortex-A55
Architecture
2x 2.27 GHz – Cortex-A76
6x 1.9 GHz – Cortex-A55
6x 1.9 GHz – Cortex-A55
8
Cores
8
12 nm
Technology
7 nm
2000 MHz
Frequency
2270 MHz
-
Transistor count
6.9
GPU Specifications
Mali-G52 MP2
GPU name
Mali-G52 MP6
950 MHz
GPU frequency
820 MHz
0.0912 TFLOPS
FLOPS
0.2362 TFLOPS
24
Shading units
24
-
Execution units
6
2.0
OpenCL version
2.0
1.3
Vulkan version
1.3
2520 x 1080
Max display resolution
3840 x 2160
-
DirectX version
12
Connectivity
-
Download speed
Up to 600 Mbps
-
4G support
LTE Cat. 12
No
5G support
No
5.4
Bluetooth
5.0
5
Wi-Fi
6
GPS, GLONASS, Beidou, Galileo
Navigation
GPS, GLONASS, Beidou, Galileo
Memory Specifications
LPDDR4X
Memory type
LPDDR4X
1800 MHz
Memory frequency
2133 MHz
2x 16 Bit
Memory Bus
4x 16 Bit
Miscellaneous
-
L2 Cache
1 MB
AIFF, CAF, MP3, MP4, WAV
Audio codecs
AIFF, CAF, MP3, MP4, WAV
1x 48MP
Max camera resolution
1x 48MP, 2x 20MP
eMMC 5.1, UFS 2.1
Storage type
eMMC 5.1, UFS 2.1
2K at 30FPS
Video capture
1K at 30FPS
H.264, H.265, VP9
Video codecs
H.264, H.265
2K at 30FPS
Video playback
1080p at 60FPS
-
TDP
5 W
ARMv8.2-A
Instruction set
ARMv8.2-A
Yes
Neural processor (NPU)
Yes
Benchmarks
Geekbench 6 Single Core
Helio G81
412
Kirin 810
774
+88%
Geekbench 6 Multi Core
Helio G81
1363
Kirin 810
1992
+46%
FP32 (float)
Helio G81
93
Kirin 810
241
+159%
AnTuTu 10
Helio G81
267388
Kirin 810
466164
+74%
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