Advantages
- Higher Technology: 4 nm (4 nm vs 6 nm)
- Higher Frequency: 3350 MHz (3350 MHz vs 2500 MHz)
- Newer Launch Date: April 2024 (November 2023 vs April 2024)
Basic
MediaTek
Label Name
MediaTek
November 2023
Launch Date
April 2024
SmartPhone Flagship
Platform
SmartPhone Mid range
TSMC
Manufacturing
TSMC
Dimensity 8300 ultra
Model Name
Dimensity 7025
1x 3.35 GHz – Cortex-A715, 3x 3.2 GHz – Cortex-A715, 4x 2.2 GHz – Cortex-A510
Architecture
2x 2.5 GHz – Cortex-A78
6x 2 GHz – Cortex-A55
6x 2 GHz – Cortex-A55
8
Cores
8
4 nm
Technology
6 nm
3350 MHz
Frequency
2500 MHz
-
Transistor count
10
GPU Specifications
Mali-G615 MP6
GPU name
IMG BXM-8-256
1400 MHz
GPU frequency
950 MHz
-
Shading units
18
-
Execution units
8
2.0
OpenCL version
3.0
1.3
Vulkan version
1.3
2960 x 1440
Max display resolution
2520 x 1080
Connectivity
-
Download speed
Up to 2770 Mbps
Yes
4G support
LTE Cat. 18
Yes
5G support
Yes
5.4
Bluetooth
5.3
6
Wi-Fi
5
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
LPDDR5X
Memory type
LPDDR5
4266 MHz
Memory frequency
3200 MHz
4x 16 Bit
Memory Bus
4x 16 Bit
Miscellaneous
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Audio codecs
AIFF, CAF, MP3, MP4, WAV
1x 320MP
Max camera resolution
1x 200MP
UFS 4.0
Storage type
UFS 2.2, UFS 3.1
4K at 60FPS
Video capture
2K at 30FPS
H.264, H.265, AV1, VP9
Video codecs
H.264, H.265, VP9
4K at 60FPS
Video playback
2K at 30FPS
-
Instruction set
ARMv8.2-A
MediaTek APU 780
Neural processor (NPU)
Yes
Benchmarks
Geekbench 6 Single Core
Dimensity 8300 Ultra
1506
+50%
Dimensity 7025
1004
Geekbench 6 Multi Core
Dimensity 8300 Ultra
4844
+92%
Dimensity 7025
2521
AnTuTu 10
Dimensity 8300 Ultra
1518170
+213%
Dimensity 7025
485165
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