MediaTek Dimensity 8200
vs
Qualcomm Snapdragon 870

vs

SoC Comparison Result

Below are the results of a comparison of MediaTek Dimensity 8200 and Qualcomm Snapdragon 870 mobile processors based on key performance characteristics, as well as power consumption and much more.

Advantages

  • Higher Technology: 4 nm (4 nm vs 7 nm)
  • Newer Launch Date: December 2022 (December 2022 vs January 2021)
  • Higher Frequency: 3200 MHz (3100 MHz vs 3200 MHz)

Basic

MediaTek
Label Name
Qualcomm
December 2022
Launch Date
January 2021
SmartPhone Flagship
Platform
SmartPhone Flagship
TSMC
Manufacturing
TSMC
MT6896Z
Model Name
SM8250-AC
1x 3.1 GHz – Cortex A78
3x 3 GHz – Cortex A78
4x 2 GHz – Cortex A55
Architecture
1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)
8
Cores
8
4 nm
Technology
7 nm
3100 MHz
Frequency
3200 MHz
-
Transistor count
10.3

GPU Specifications

Mali-G610 MP6
GPU name
Adreno 650
950 MHz
GPU frequency
670 MHz
1.442 TFLOPS
FLOPS
1.3721 TFLOPS
-
Shading units
512
6
Execution units
2
2.0
OpenCL version
2.0
1.3
Vulkan version
1.1
2960 x 1440
Max display resolution
3840 x 2160
-
DirectX version
12.1

Connectivity

Up to 4700 Mbps
Download speed
Up to 7500 Mbps
LTE Cat. 21
4G support
LTE Cat. 22
Yes
5G support
Yes
5.3
Bluetooth
5.2
6
Wi-Fi
6
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC

Memory Specifications

LPDDR5
Memory type
LPDDR5
3200 MHz
Memory frequency
2750 MHz
4x 16 Bit
Memory Bus
4x 16 Bit

Miscellaneous

-
L2 Cache
1 MB
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
1x 320MP
Max camera resolution
1x 200MP, 2x 25MP
UFS 3.1
Storage type
UFS 3.0, UFS 3.1
4K at 60FPS
Video capture
8K at 30FPS, 4K at 60FPS
H.264, H.265, AV1, VP9
Video codecs
H.264, H.265, VP8, VP9
4K at 60FPS
Video playback
8K at 30FPS, 4K at 60FPS
6 W
TDP
6 W
ARMv8.2-A
Instruction set
ARMv8.2-A
MediaTek APU 580
Neural processor (NPU)
Hexagon 698

Benchmarks

Geekbench 6 Single Core
Dimensity 8200
1229 +7%
Snapdragon 870
1151
Geekbench 6 Multi Core
Dimensity 8200
3892 +17%
Snapdragon 870
3336
FP32 (float)
Dimensity 8200
1413 +5%
Snapdragon 870
1345
AnTuTu 10
Dimensity 8200
915634 +15%
Snapdragon 870
794278