MediaTek Dimensity 8200 vs HiSilicon Kirin 9000S
SoC Comparison Result
Below are the results of a comparison of MediaTek Dimensity 8200 and HiSilicon Kirin 9000S mobile processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Higher Technology: 4 nm (4 nm vs 14 nm)
- Higher Frequency: 3100 MHz (3100 MHz vs 2620 MHz)
- Higher Max Bandwidth: 51.2 Gbit/s (51.2 Gbit/s vs 44 Gbit/s)
- Newer Launch Date: August 2023 (December 2022 vs August 2023)
Basic
MediaTek
Label Name
HiSilicon
December 2022
Launch Date
August 2023
SmartPhone Flagship
Platform
SmartPhone Flagship
TSMC
Manufacturing
SMIC
MT6896Z
Model Name
Kirin 9000S
1x 3.1 GHz – Cortex A78
3x 3 GHz – Cortex A78
4x 2 GHz – Cortex A55
Architecture
2x 2.62 GHz – Cortex-X1
4x 2.15 GHz – Cortex-A710
6x 1.53 GHz – Cortex-A510
8
Cores
12
4 nm
Technology
14 nm
3100 MHz
Frequency
2620 MHz
GPU Specifications
Mali-G610 MP6
GPU name
Maleoon 910
950 MHz
GPU frequency
750 MHz
1.442 TFLOPS
FLOPS
-
6
Execution units
-
2.0
OpenCL version
-
1.3
Vulkan version
-
2960 x 1440
Max display resolution
3840 x 2160
Connectivity
LTE Cat. 21
4G support
LTE Cat. 24
Yes
5G support
Yes
5.3
Bluetooth
5.2
6
Wi-Fi
6
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
LPDDR5
Memory type
LPDDR5
3200 MHz
Memory frequency
2750 MHz
4x 16 Bit
Memory Bus
4x 16 Bit
51.2 Gbit/s
Max Bandwidth
44 Gbit/s
Miscellaneous
MediaTek APU 580
Neural processor (NPU)
Yes
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
1x 320MP
Max camera resolution
-
UFS 3.1
Storage type
UFS 4.0
4K at 60FPS
Video capture
4K at 60FPS
H.264, H.265, AV1, VP9
Video codecs
H.264, H.265, VP9
4K at 60FPS
Video playback
4K at 60FPS
6 W
TDP
7 W
ARMv8.2-A
Instruction set
-
Benchmarks
Geekbench 6 Single Core
Dimensity 8200
1229
+1%
Kirin 9000S
1222
Geekbench 6 Multi Core
Dimensity 8200
3892
+7%
Kirin 9000S
3622
AnTuTu 10
Dimensity 8200
915634
Kirin 9000S
923510
+1%
