MediaTek Dimensity 8050
vs
HiSilicon Kirin 9010s
vs
SoC Comparison Result
Below are the results of a comparison of
MediaTek Dimensity 8050
and
HiSilicon Kirin 9010s
mobile processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Higher Technology: 6 nm (6 nm vs 7 nm)
- Newer Launch Date: July 2025 (May 2023 vs July 2025)
Basic
MediaTek
Label Name
HiSilicon
May 2023
Launch Date
July 2025
SmartPhone Mid range
Platform
SmartPhone Flagship
TSMC
Manufacturing
-
MT6893, MT6893Z_T/CZA
Model Name
Kirin 9010s
1x 3 GHz – Cortex-A78
3x 2.6 GHz – Cortex-A78
4x 2 GHz – Cortex-A55
3x 2.6 GHz – Cortex-A78
4x 2 GHz – Cortex-A55
Architecture
2 cores x 2.5GHz + 6 cores x 2.05GHz + 4 cores x 1.50GHz
8
Cores
12
6 nm
Technology
7 nm
3000 MHz
Frequency
-
GPU Specifications
Mali-G77 MP9
GPU name
-
850 MHz
GPU frequency
-
0.9792 TFLOPS
FLOPS
-
64
Shading units
-
9
Execution units
-
2.0
OpenCL version
-
1.3
Vulkan version
-
2520 x 1080
Max display resolution
-
Connectivity
Up to 4700 Mbps
Download speed
-
LTE Cat. 21
4G support
Yes
Yes
5G support
-
5.2
Bluetooth
Bluetooth 5.2, поддержка BLE, SBC, AAC, LDAC и L2HC.
6
Wi-Fi
802.11a/b/g/n/ac/ax/be, 2 × 2 MIMO, EHT160
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
-
Memory Specifications
LPDDR4X
Memory type
-
2133 MHz
Memory frequency
-
4x 16 Bit
Memory Bus
-
Miscellaneous
AIFF, CAF, MP3, MP4, WAV
Audio codecs
-
1x 200MP
Max camera resolution
-
UFS 3.1
Storage type
-
4K at 60FPS
Video capture
-
H.264, H.265, AV1, VP9
Video codecs
-
4K at 60FPS
Video playback
-
ARMv8.2-A
Instruction set
-
MediaTek APU 570
Neural processor (NPU)
-
Benchmarks
Geekbench 6 Single Core
Dimensity 8050
1119
Kirin 9010s
1442
+29%
Geekbench 6 Multi Core
Dimensity 8050
3242
Kirin 9010s
4443
+37%
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