MediaTek Dimensity 7300 vs Qualcomm Snapdragon 7s Gen 3
SoC Comparison Result
Below are the results of a comparison of
MediaTek Dimensity 7300
and
Qualcomm Snapdragon 7s Gen 3
mobile processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Newer Launch Date: August 2024 (June 2024 vs August 2024)
Basic
MediaTek
Label Name
Qualcomm
June 2024
Launch Date
August 2024
SmartPhone Mid range
Platform
SmartPhone Mid range
TSMC
Manufacturing
TSMC
Dimensity 7300
Model Name
SM7635
4x 2.5 GHz – Cortex-A784x 2 GHz – Cortex-A55
Architecture
1x 2.5 GHz – Kryo Prime3x 2.4 GHz – Kryo Gold4x 1.8 GHz – Kryo Silver
8
Cores
8
4 nm
Technology
4 nm
2500 MHz
Frequency
2500 MHz
GPU Specifications
Mali-G615 MP6
GPU name
-
6
Execution units
-
2.0
OpenCL version
-
1.3
Vulkan version
-
2520 x 1080
Max display resolution
3360 x 1600
Connectivity
Yes
5G support
Yes
5.4
Bluetooth
5.4
6
Wi-Fi
6
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC
Memory Specifications
LPDDR5
Memory type
LPDDR5
3200 MHz
Memory frequency
3200 MHz
4x 16 Bit
Memory Bus
2x 16 Bit
Miscellaneous
MediaTek APU 655
Neural processor (NPU)
Yes
AAC LC, MP3, HE-AACv1, HE-AACv2, FLAC
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
1x 200MP
Max camera resolution
1x 200MP
UFS 3.1
Storage type
UFS 2.2, UFS 3.1
4K at 30FPS
Video capture
4K at 30FPS
H.264, H.265, VP9
Video codecs
H.264, H.265
4K at 30FPS
Video playback
4K at 30FPS
ARMv8.2-A
Instruction set
ARMv8.6-A
Benchmarks
Geekbench 6 Single Core
Dimensity 7300
1064
Snapdragon 7s Gen 3
1196
+12%
Geekbench 6 Multi Core
Dimensity 7300
2939
Snapdragon 7s Gen 3
3087
+5%
AnTuTu 10
Dimensity 7300
726869
Snapdragon 7s Gen 3
809304
+11%
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