HiSilicon Kirin 9010s
vs
Qualcomm Snapdragon 870
vs
SoC Comparison Result
Below are the results of a comparison of
HiSilicon Kirin 9010s
and
Qualcomm Snapdragon 870
mobile processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Newer Launch Date: July 2025 (July 2025 vs January 2021)
Basic
HiSilicon
Label Name
Qualcomm
July 2025
Launch Date
January 2021
SmartPhone Flagship
Platform
SmartPhone Flagship
-
Manufacturing
TSMC
Kirin 9010s
Model Name
SM8250-AC
2 cores x 2.5GHz + 6 cores x 2.05GHz + 4 cores x 1.50GHz
Architecture
1x 3.2 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)
12
Cores
8
7 nm
Technology
7 nm
-
Frequency
3200 MHz
-
Transistor count
10.3
GPU Specifications
-
GPU name
Adreno 650
-
GPU frequency
670 MHz
-
FLOPS
1.3721 TFLOPS
-
Shading units
512
-
Execution units
2
-
OpenCL version
2.0
-
Vulkan version
1.1
-
Max display resolution
3840 x 2160
-
DirectX version
12.1
Connectivity
-
Download speed
Up to 7500 Mbps
Yes
4G support
LTE Cat. 22
-
5G support
Yes
Bluetooth 5.2, поддержка BLE, SBC, AAC, LDAC и L2HC.
Bluetooth
5.2
802.11a/b/g/n/ac/ax/be, 2 × 2 MIMO, EHT160
Wi-Fi
6
-
Navigation
GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NAVIC
Memory Specifications
-
Memory type
LPDDR5
-
Memory frequency
2750 MHz
-
Memory Bus
4x 16 Bit
Miscellaneous
-
L2 Cache
1 MB
-
Audio codecs
AAC, AIFF, CAF, MP3, MP4, WAV
-
Max camera resolution
1x 200MP, 2x 25MP
-
Storage type
UFS 3.0, UFS 3.1
-
Video capture
8K at 30FPS, 4K at 60FPS
-
Video codecs
H.264, H.265, VP8, VP9
-
Video playback
8K at 30FPS, 4K at 60FPS
-
TDP
6 W
-
Instruction set
ARMv8.2-A
-
Neural processor (NPU)
Hexagon 698
Benchmarks
Geekbench 6 Single Core
Kirin 9010s
1442
+25%
Snapdragon 870
1151
Geekbench 6 Multi Core
Kirin 9010s
4443
+33%
Snapdragon 870
3336
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