AMD Ryzen AI 5 330

AMD Ryzen AI 5 330

AMD Ryzen AI 5 330 — an entry-level mobile APU with a 50-TOPS NPU

A compact, entry-level mobile processor for the Copilot+ PC platform. It combines 4 cores/8 threads on Zen 5/Zen 5c, a simple integrated Radeon 820M GPU, and a built-in XDNA 2 NPU rated up to 50 TOPS. It targets thin-and-light laptops and mini-PCs with a focus on efficiency and on-device AI scenarios.

Key specifications

  • Architecture / codename, process node: hybrid Zen 5 + Zen 5c; Ryzen AI 300 family (mobile APU generation); 4 nm node.

  • Cores / threads: 4 / 8 (1 performance Zen 5 and 3 efficiency-oriented Zen 5c; SMT enabled).

  • Frequencies (base; boost): ~2.0 GHz; up to ~4.5 GHz (actual values depend on power/thermal profiles).

  • L3 cache: 8 MB (L2 — 4 MB).

  • Power envelope: default TDP 28 W; cTDP range 15–28 W.

  • Integrated graphics: Radeon 820M (RDNA 3.5), 2 CU / 128 ALUs; aimed at basic 2D/video workloads and light 1080p gaming.

  • Memory: dual-channel DDR5-5600 or LPDDR5X-8000; a full dual-channel configuration is critical.

  • Interfaces: 14 native PCIe 4.0 lanes (allocation varies by OEM), USB4 (up to 40 Gbps, typically 2 ports), USB 3.2 Gen 2 (10 Gbps), output to up to four displays via USB-C (DP Alt Mode)/HDMI depending on implementation.

  • NPU / Ryzen AI: XDNA 2, up to 50 TOPS INT8; enables on-device features (including Copilot+ PC functions in Windows).

  • Optional: performance positioning: below Ryzen AI 5 340/AI 7 350 in multi-thread and graphics; single-thread performance can be close to Zen 5 levels of higher SKUs at similar clocks.

What this chip is and where it fits

Ryzen AI 5 330 is the most affordable member of the Ryzen AI 300 lineup for mobile. The model is intended for mainstream thin laptops, budget Copilot+ systems, and compact mini-PCs where long battery life, quiet operation, and baseline on-device AI capabilities matter. Within the 300-series hierarchy it sits below Ryzen AI 5 340, Ryzen AI 7 350, and AI 9 SKUs, emphasizing cost and efficiency.

Architecture and process

The die uses a hybrid layout: performance Zen 5 cores are paired with efficiency-focused Zen 5c cores. This allows task-type scheduling: peak single-thread bursts on the larger cores, sustained background or service workloads on the compact ones. The cache subsystem includes 4 MB of L2 (1 MB per core) and 8 MB of shared L3 — sufficient for desktop apps, heavy browser use, IDEs, and office suites at the entry tier.

The multimedia blocks support modern video codecs up to AV1 (hardware decode), along with HEVC and H.264; hardware encode capabilities depend on the iGPU media engines, but everyday streaming and video calls are covered. The memory controller supports both socketed DDR5 and high-speed LPDDR5X — the trade-off between latency and bandwidth depends on platform goals and the notebook’s design.

CPU performance

In day-to-day workloads — office apps, browsers with dozens of tabs, video conferencing, light development and builds of smaller projects, simple photo tasks — Ryzen AI 5 330 delivers snappy behavior via Zen 5 IPC and boost clocks up to ~4.5 GHz. In heavily parallel scenarios (large-scale rendering, very big codebases, multi-threaded archiving), four cores/eight threads become the limiting factor; acceleration is bounded by the core count and TDP.

A practical note: results scale with the thermal package and cooling system. In chassis holding TDP at 15–18 W, sustained clocks under long load will be lower than in designs configured at 25–28 W with more robust heatpipes. This primarily affects lengthy batch jobs: the better the cooling and the higher the power limit, the closer sustained performance gets to short-term peaks.

Graphics and multimedia (iGPU)

The integrated Radeon 820M (RDNA 3.5, 2 CU/128 ALUs) targets UI acceleration, media playback, and basic graphics. For games, think 1080p on low/occasionally medium presets in lighter and competitive titles, with wide variation by game and settings. For AAA titles and high presets, a discrete GPU or higher-tier AI 300 APU with more CUs is preferable.

Memory bandwidth strongly affects the iGPU: dual-channel LPDDR5X-8000 delivers better frame pacing than DDR5-5600, though final results depend on timings, controller behavior, and power limits. For media, AV1/HEVC/H.264 hardware decode ensures smooth 4K streaming with low power draw.

AI / NPU

The built-in XDNA 2 NPU rated up to 50 TOPS accelerates on-device AI: speech transformations (captions, noise suppression), video effects (background blur, auto-framing), on-device object recognition, metadata generation, and local inference for moderate-size models. The NPU offloads CPU/GPU, reduces power in those tasks, and satisfies Copilot+ PC requirements. NPU capability is consistent across the Ryzen AI 300 family, simplifying developer targeting.

Platform and I/O

A typical mobile platform around Ryzen AI 5 330 provides:

  • PCIe: 14 native lanes of PCIe 4.0. OEMs split them between NVMe storage and, where present, discrete graphics or high-speed controllers; exact routing varies by device.

  • USB/Thunderbolt: native USB4 (up to 40 Gbps), commonly two fully featured USB-C ports with DP Alt Mode and Power Delivery; plus USB 3.2 Gen 2 (10 Gbps). Thunderbolt interoperability depends on system-level certification.

  • Displays: up to four independent outputs (combinations of USB-C/DP Alt Mode and HDMI), subject to the notebook or mini-PC implementation.

  • Networking & storage: typically Wi-Fi 6E/7 via the OEM’s module, one or two M.2 2280 (PCIe 4.0 ×4) for NVMe, sometimes a card reader slot.

Power consumption and cooling

With a 15–28 W cTDP range and a compact die, the 330 is tailored to slim chassis. In “Balanced”/“Silent” profiles it maintains low temperatures and noise at the expense of sustained performance; in “Performance” profiles sustained clocks are higher but cooling becomes the priority. With sensible fan curves and a competent heatpipe, the CPU avoids pronounced frequency “sawtoothing” under long loads.

Where it appears

Expect Ryzen AI 5 330 in mainstream 13–15-inch entry-level laptops, education and office-oriented models, and compact mini-PCs focused on office work, multimedia, light development, and everyday tasks. Specific series and timelines depend on OEMs.

Comparison and positioning

  • Versus Ryzen AI 5 340: the 340 brings 6 cores/12 threads and Radeon 840M (4 CU), clearly boosting multi-threaded and graphics performance. NPU is the same (50 TOPS); TDP is similar. The 330 trades raw throughput for lower cost and simpler graphics/core counts.

  • Versus Ryzen AI 7 350: 8 cores/16 threads and a stronger iGPU (860M, 8 CU) move the 350 into a different class for rendering, encoding, and gaming. The power envelope is comparable, with greater cooling demands.

  • Versus Ryzen AI 9 (365/370/HX): double-digit core counts, higher boosts, and large iGPUs (880M/890M) define the premium tier. The 330 is the baseline entry to Copilot+ PCs, optimized for efficiency and value.

Who it suits

  • Office and study: documents, spreadsheets, presentations, video calls, note-taking with local transcription — with long battery life.

  • Browsing and everyday tasks: heavy tab use, mail, messaging, online services.

  • Light development and automation: IDE work, builds for small/medium projects, local scripts; for CI with very high parallelism, higher SKUs are advisable.

  • Multimedia: 4K playback, basic clip editing, format conversion without strict deadlines.

  • Entry-level gaming: lighter titles at 1080p on low/medium settings; for AAA or high FPS, aim for a dGPU or higher APU.

Pros and cons

Pros

  • XDNA 2 NPU at 50 TOPS — same AI acceleration level as higher AI 300 models.

  • Modern I/O (USB4, 14 lanes of PCIe 4.0), support for up to four displays.

  • Strong efficiency with a wide 15–28 W cTDP span.

  • Support for fast LPDDR5X memory and hardware AV1 decode.

Cons

  • Only 4 cores/8 threads limit heavily parallel workloads.

  • Radeon 820M with 2 CUs is the minimal 3D tier in the family.

  • Sustained clocks depend noticeably on cooling and power limits.

  • I/O routing and port speeds vary with each notebook design.

Configuration recommendations

  • Memory: strictly dual-channel; for iGPU, prefer LPDDR5X-7500/8000. Capacity — at least 16 GB; 32 GB gives headroom for IDEs, browsers, and media apps.

  • Storage: NVMe PCIe 4.0 ×4; for working datasets, consider two M.2 drives (system + data/cache).

  • Cooling: prioritize designs with a mid-sized fan and heatpipe; “Balanced/Performance” profiles with sensible curves help sustain clocks in long jobs.

  • Power modes: on AC, use “Performance” and allow higher power limits within 25–28 W; on battery, “Balanced” extends runtime with modest performance trade-offs.

  • Graphics/displays: for multi-monitor use, ensure two USB4 ports with DP Alt Mode; for occasional editing and encode offload, lean on AV1/HEVC paths where hardware engines are most efficient.

Summary

Ryzen AI 5 330 is a cost-effective entry to the Copilot+ PC ecosystem: modern Zen 5/Zen 5c architecture, a platform-standard 50-TOPS NPU, and a basic iGPU adequate for UI, video, and light gaming. For heavy multi-thread and 3D workloads, AI 5 340/AI 7 350 with more cores and CUs are better fits, but in compact and affordable laptops the 330 strikes the needed balance of efficiency, contemporary I/O, and on-device AI capability. When priorities are battery life, office/browsing/media, and local AI features, this processor fits the brief; for intensive rendering, wide parallel builds, or high-end gaming, choose a higher-tier SKU or add a discrete GPU.

Básico

Nome do rótulo
AMD
Plataforma
Laptop
Data de lançamento
July 2025
Nome do modelo
?
O número do processador Intel é apenas um dos vários fatores – junto com a marca do processador, configurações do sistema e benchmarks no nível do sistema – a serem considerados ao escolher o processador certo para suas necessidades de computação.
Ryzen AI 5 330
Nome de código
Krackan Point 2
Fundição
TSMC
Geração
Ryzen AI (Zen 5)

Especificações da CPU

Total de Núcleos
?
Núcleos é um termo de hardware que descreve o número de unidades de processamento central independentes em um único componente de computação (matriz ou chip).
4
Total de Threads
?
Quando aplicável, a tecnologia Intel® Hyper-Threading está disponível apenas em núcleos de desempenho.
8
Frequência Base do Núcleo de Desempenho
2 GHz
Frequência Base do Núcleo de Eficiência
2000 MHz
Frequência Turbo do Núcleo de Desempenho
?
Frequência turbo máxima do P-core derivada da tecnologia Intel® Turbo Boost.
4.5 GHz
Cache L1
80 KB per core
Cache L2
1 MB per core (4MB total)
Cache L3
8 MB
Frequência do Barramento
100 MHz
Multiplicador
20.0
Multiplicador Desbloqueado
No
Soquete
?
O soquete é o componente que fornece as conexões mecânicas e elétricas entre o processador e a placa-mãe.
AMD Socket FP8
Processo de Fabricação
?
Litografia refere-se à tecnologia de semicondutores usada para fabricar um circuito integrado e é relatada em nanômetros (nm), indicativo do tamanho dos recursos construídos no semicondutor.
4 nm
Consumo de Energia
28 W
Temperatura Operacional Máxima
?
Temperatura de junção é a temperatura máxima permitida na matriz do processador.
100°C
Versão do PCIe
?
PCI Express é um padrão de barramento de expansão de computador serial de alta velocidade usado para conectar componentes de alta velocidade, substituindo padrões mais antigos como AGP, PCI e PCI-X. Ele passou por várias revisões e melhorias desde o seu lançamento inicial. O PCIe 1.0 foi introduzido pela primeira vez em 2002, e para atender à crescente demanda por maior largura de banda, versões subsequentes foram lançadas ao longo do tempo.
4

Especificações de memória

Tipos de memória
?
Os processadores Intel® vêm em quatro tipos diferentes: canal único, canal duplo, canal triplo e modo Flex. A velocidade máxima de memória suportada pode ser menor ao preencher vários DIMMs por canal em produtos que suportam vários canais de memória.
LPDDR5x-8000, DDR5-5600
Canais máximos de memória
?
O número de canais de memória refere-se à operação de largura de banda para aplicação no mundo real.
2
Suporte de memória ECC
No

Especificações de GPU

Gráficos integrados
?
Uma GPU integrada refere-se ao núcleo gráfico integrado ao processador da CPU. Aproveitando os poderosos recursos computacionais do processador e o gerenciamento inteligente de eficiência de energia, ele oferece excelente desempenho gráfico e uma experiência de aplicação suave com menor consumo de energia.
Radeon 820M
Frequência gráfica
?
A frequência dinâmica máxima de gráficos refere-se à frequência máxima de clock de renderização de gráficos oportunistas (em MHz) que pode ser suportada usando Intel® HD Graphics com recurso de frequência dinâmica.
2800 MHz
Graphics Core Count
2
DirectX Support
?
DirectX* Support indicates support for a specific version of Microsoft’s collection of APIs (Application Programming Interfaces) for handling multimedia compute tasks.
12
Resolução máxima
7680x4320 @ 60Hz , 3840x2160 @ 240Hz , 3440x1440 @ 360Hz , 2560x1440 @ 480Hz , 1920x1080 @ 600Hz
Number of Displays Supported
4

Diversos

Faixas PCIe
14

Classificações

Geekbench 6
Núcleo Único Pontuação
2131
Geekbench 6
Multinúcleo Pontuação
7079

Comparado com outra CPU

Geekbench 6 Núcleo Único
2314 +8.6%
2207 +3.6%
2034 -4.6%
1934 -9.2%
Geekbench 6 Multinúcleo
8035 +13.5%
7510 +6.1%
6673 -5.7%
6311 -10.8%