AMD Ryzen 7 8745HS

AMD Ryzen 7 8745HS

AMD Ryzen 7 8745HS: a mobile 8-core APU of the Hawk Point generation

Ryzen 7 8745HS is a mid-to-upper mobile processor for thin high-performance laptops and mini-PCs. The chip combines 8 cores/16 threads based on the Zen 4 architecture and RDNA 3 integrated graphics (typically Radeon 780M), targeting versatile scenarios: development, multimedia, light to moderate 1080p gaming, and compact workstations. The model belongs to the HS class with a flexible power envelope and adjustable TDP.

Key specifications

  • Architecture/codename, process: Zen 4, “Hawk Point,” TSMC N4 (4 nm)

  • Cores/threads: 8 / 16

  • Frequencies (base; boost): around 3.8 GHz base; up to ≈5.0–5.1 GHz in turbo (dependent on cooling and power limits)

  • L3 cache: 16 MB

  • Power envelope: HS-class 35–54 W; cTDP within this range set by the device manufacturer

  • Integrated graphics: RDNA 3; typically Radeon 780M (12 CUs) or a close configuration; iGPU frequency set by BIOS/cooling

  • Memory: dual-channel DDR5-5600 or LPDDR5(X) up to ~7500 MT/s (exact values per device spec)

  • Interfaces: PCIe 4.0 for NVMe and discrete graphics; USB4 (up to 40 Gbit/s) where implemented on the platform; up to 4 displays via HDMI/DisplayPort/USB-C (support depends on the laptop/mini-PC)

  • NPU / Ryzen AI: in typical configurations no hardware NPU; AI workloads run on CPU/GPU

  • Indicative capabilities: performance level comparable to top 8-core mobile Phoenix/Hawk Point APUs under equal power limits

What this chip is and where it is used

Ryzen 7 8745HS is part of the Hawk Point mobile APU family and is positioned between the lower Ryzen 5 HS and the higher Ryzen 9 HS models. The HS index indicates a focus on thin and relatively light systems with an emphasis on energy efficiency and predictable thermal behavior. The model is widely used in 14–16-inch general-purpose laptops, compact creator-oriented machines, and mini-PCs where an 8-core CPU and strong integrated graphics with modern codecs and I/O are important.

Architecture and process

The core is Zen 4 with support for modern instruction sets, a wide vector engine, and an advanced branch prediction subsystem. Fabrication on TSMC N4 (4 nm) improves performance-per-watt and sustains high turbo frequencies within a constrained power envelope.

The cache subsystem includes 16 MB L3 (per CCD) and sizable L2/L1 buffers, reducing memory traffic and improving responsiveness in typical tasks: heavy browser workloads, IDEs and builds, photo/video export, and compression. The memory controller supports dual-channel DDR5 and LPDDR5/LPDDR5X; in real devices LPDDR5X at effective ≈7500 MT/s is common, which is especially beneficial for the integrated GPU.

Graphics is based on RDNA 3 (typically Radeon 780M, 12 CUs). Multimedia blocks include hardware AV1 decode, along with HEVC/H.265 and H.264; hardware encode is available for HEVC/H.264 (capabilities depend on drivers and the specific iGPU implementation). The display engine supports multiple monitors, including high resolution and refresh rates; concrete ports and maximum parameters are defined by the device vendor.

CPU performance

At 35–54 W TDP, the Ryzen 7 8745HS delivers a high level of multi-threaded performance for an 8-core mobile APU. In compilation, archiving, and rendering the behavior is predictable:

  • at lower cTDP (~35 W) the chip reaches a sustained thermal plateau sooner, limiting long turbo residency while maintaining good efficiency per watt;

  • at raised limits (45–54 W) sustained performance improves in multi-threaded tests and long exports—provided adequate cooling.

In interactive workloads (IDEs, browsers, office suites, light design tools) single-thread turbo up to ~5 GHz provides responsive UI. In prolonged benchmarks, sustained clocks depend on the cooling design and power profile, so laptops and mini-PCs with more robust thermal solutions predictably score better over long runs.

Graphics and multimedia (iGPU)

The Zen 4 + RDNA 3 pairing brings strong integrated graphics. A Radeon 780M (12 CUs)-class configuration covers a wide set of multimedia tasks: 4K video decode, GPU-accelerated effects in supported editors, and fast timeline previews. In 1080p gaming the typical picture is:

  • Esports and lighter titles — stable high frame rates on low/medium presets.

  • Recent AAA titles — workable “low–medium” settings with render-resolution adjustments and upscaling (FSR) to keep smoothness.

A crucial factor is memory bandwidth. With LPDDR5X-7500 in dual-channel mode the iGPU gains noticeably versus single-channel DDR5-5600. For mini-PCs/laptops with SO-DIMMs, using two sticks (dual-channel) is advisable; for laptops with soldered LPDDR5X, higher speed and capacity configurations are preferable.

AI/NPU

In common versions, the Ryzen 7 8745HS does not include an XDNA (Ryzen AI) NPU. This means on-device inference runs on CPU and/or iGPU via appropriate frameworks (e.g., DirectML, Vulkan, ROCm in supported scenarios). The absence of an NPU does not prevent local models, but it affects energy efficiency and sustained throughput in longer AI workloads: under the same conditions, platforms with an NPU usually consume less energy per token/frame at comparable speeds in NPU-optimized tasks. OS-level effects (noise suppression, background for video, live captions) remain available where software supports them, but will more often use the GPU.

Platform and I/O

The APU’s I/O targets PCIe 4.0. A typical layout provides x4 PCIe 4.0 for NVMe storage and lanes for a discrete GPU (in laptops with dGPU, PCIe 4.0 x8/x4 is common depending on design). Many 8745HS devices offer USB4 with bandwidth up to 40 Gbit/s, including DisplayPort Alt Mode for external monitors over USB-C. Support for HDMI 2.1/DisplayPort 1.4/2.1 is implemented at the platform level and varies by model; the number of simultaneously connected displays typically reaches four (including the built-in laptop panel).

Networking options include Wi-Fi 6/6E or Wi-Fi 7 depending on the module; wired interfaces are often provided via USB4/Thunderbolt-compatible docks.

Power consumption and cooling

The HS class (35–54 W) implies the device manufacturer can tune cTDP to match the cooling system. In practice this leads to differences in sustained clocks and acoustic behavior:

  • at 35–40 W devices run quieter and cooler, turbo peaks are shorter, and CPU/iGPU sustain comfortable levels for office and development tasks;

  • at 45–54 W sustained multi-thread performance and iGPU potential increase, but thermal requirements are higher and acoustics are more active under load.

Cooling design (heatsink area, heat pipes, chassis airflow) directly affects the ability to hold clocks in rendering, NLE exports, and long gaming sessions.

Where the processor is found

Ryzen 7 8745HS is used in:

  • 14–16-inch universal laptops and performant ultrabooks;

  • compact creator-focused systems emphasizing photo/video work, where codecs, iGPU, and battery life matter;

  • mini-PCs with active cooling, aimed at roles such as a desktop all-rounder, media player, or light gaming machine.

Comparison and positioning

Within Hawk Point, the 8745HS sits below the higher Ryzen 9 HS and Ryzen 7 8845HS, but above Ryzen 5 HS in core count and graphics configuration. Key differences with neighbors:

  • Ryzen 7 8845HS: similar 8-core base, often slightly higher clocks and frequently an NPU (Ryzen AI) in certain configurations.

  • Ryzen 7 8645HS / 8545HS: conceptually similar with moderately lower clocks/limits and sometimes different iGPU configs.

  • U-series (e.g., 8840U): optimized for lower power and battery life; under sustained load the HS class generally leads thanks to higher power limits.

  • HX-series: designed for maximum performance and higher TDP, mostly in gaming laptops with discrete GPUs.

Overall, the 8745HS is the “sweet spot” of the HS class for devices balancing CPU/iGPU capabilities with manageable thermals.

Who is it for

  • Development and engineering: IDEs, project builds, containers and light VMs, analytics tools—assuming ample RAM and fast NVMe.

  • Multimedia and content creation: photo processing, FHD/standard 4K video editing with proxy/optimized media; hardware codecs and iGPU acceleration help with previews.

  • General 1080p gaming: esports and many titles on low/medium presets with careful tuning; for heavier games, reduce presets and use upscaling.

  • Home and office workstation: multitasking, many tabs and apps, video conferencing with driver-level enhancements.

Pros and cons

Pros

  • 8 cores/16 threads of Zen 4 with high turbo clocks and solid efficiency.

  • Strong RDNA 3 iGPU (780M-class) with modern multimedia support, including AV1 decode.

  • Flexible HS power envelope (35–54 W) enabling tuning for thin laptops and mini-PCs.

  • USB4 (up to 40 Gbit/s) and PCIe 4.0 support, fast NVMe, multi-monitor setups.

  • Effective with LPDDR5X memory; iGPU benefits significantly from fast dual-channel configurations.

Cons

  • In typical configs no hardware NPU; AI workloads fall on CPU/GPU with lower energy efficiency versus XDNA-equipped models.

  • Sustained performance under long load strongly depends on cooling quality and chosen cTDP.

  • Without a discrete GPU, AAA gaming requires lowering presets and render resolution for comfortable frame rates.

  • Not all devices implement USB4 and top-tier display outputs—realization varies by vendor.

  • Graphics driver and BIOS updates influence stability and scores; software state matters.

Configuration recommendations

  • Memory: with SO-DIMMs use two DDR5 sticks for dual-channel; DDR5-5600 is sensible. With soldered LPDDR5X, favor configurations with higher speed and capacity—the iGPU gains from bandwidth.

  • Storage: NVMe PCIe 4.0 x4 with strong sustained performance; for workstations, a second slot for projects/cache is useful if available.

  • Cooling: systems with dual fans and robust heat-pipe designs deliver better sustained clocks; when power profiles are available, prefer “balanced/performance” for heavy tasks and “quiet/efficient” for office work.

  • Power and profiles: with 45–54 W cTDP sustained performance in rendering/export improves; for mobile-first use, 35–40 W may be preferable for battery life and acoustics.

  • Displays and ports: for external 4K setups, look for USB4/DP Alt Mode and verify support for required standards (HDMI 2.1/DP 1.4/2.1).

Conclusion

Ryzen 7 8745HS is a well-balanced 8-core mobile APU from the Hawk Point family, combining strong CPU performance with one of the most capable integrated graphics solutions. Its flexible HS-class power envelope adapts to a wide range of devices—from thin laptops to mini-PCs. It fits scenarios requiring a universal machine for development, multimedia, and moderate 1080p gaming without a mandatory discrete GPU. If priorities are energy-efficient on-device AI with a hardware NPU or maximum gaming performance, neighboring XDNA-equipped SKUs or systems with discrete graphics are alternatives. In other cases, the Ryzen 7 8745HS delivers up-to-date performance and platform features with modern I/O and multimedia capabilities.

Basic

Label Name
AMD
Platform
Laptop
Launch Date
July 2024
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Ryzen 7 8745HS
Code Name
Zen 4 (Hawk Point)

CPU Specifications

Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
8
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
16
Performance-cores
8
Performance-core Base Frequency
3.8 GHz
Performance-core Max Turbo Frequency
?
Maximum P-core turbo frequency derived from Intel® Turbo Boost Technology.
5.1 GHz
L1 Cache
64 K per core
L2 Cache
1 MB per core
L3 Cache
16 MB shared
Unlocked Multiplier
No
Multiplier
38
Bus Frequency
100 MHz
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
FP8
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
4 nm
TDP
15
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
100 °C
PCIe Version
?
PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.
4.0
Instruction Set
?
The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.
x86-64
Transistor Count
25 billions

Memory Specifications

Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR5-5600,LPDDR5x-7500
ECC Memory Support
No

GPU Specifications

Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
true
GPU Base Frequency
800 MHz
GPU Max Dynamic Frequency
2600 MHz
Execution Units
?
The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.
12

Miscellaneous

PCIe Lanes
20

Benchmarks

Cinebench R23
Single Core Score
1749
Cinebench R23
Multi Core Score
16068
Geekbench 6
Single Core Score
2359
Geekbench 6
Multi Core Score
10351
Passmark CPU
Single Core Score
3789
Passmark CPU
Multi Core Score
29232
Cinebench 2024
Single Core Score
98
Cinebench 2024
Multi Core Score
867

Compared to Other CPU

Cinebench R23 Single Core
2424 +38.6%
1895 +8.3%
1124 -35.7%
Cinebench R23 Multi Core
45651 +184.1%
18920 +17.7%
11558 -28.1%
Geekbench 6 Single Core
2659 +12.7%
2511 +6.4%
2168 -8.1%
Geekbench 6 Multi Core
12069 +16.6%
11150 +7.7%
9696 -6.3%
9133 -11.8%
Passmark CPU Single Core
3926 +3.6%
3858 +1.8%
3701 -2.3%
3617 -4.5%
Passmark CPU Multi Core
32612 +11.6%
30710 +5.1%
27806 -4.9%
26429 -9.6%
Cinebench 2024 Single Core
M2
118 +20.4%
111 +13.3%
107 +9.2%
103 +5.1%
Cinebench 2024 Multi Core
1360 +56.9%
1087 +25.4%
809 -6.7%
785 -9.5%