Home / CPU Comparison / Intel Processor N95 or Qualcomm Snapdragon X X1-26-100: What's better?

Intel Processor N95

vs

Qualcomm Snapdragon X X1-26-100

CPU Comparison Result

Below are the results of a comparison of Intel Processor N95 and Qualcomm Snapdragon X X1-26-100 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

Qualcomm Snapdragon X X1-26-100

More Total Cores: 8 (4 vs 8)
Higher Technology: 4nm (10 nm vs 4nm)
Newer Launch Date: January 2025 (January 2023 vs January 2025)

Basic

Intel

Label Name

Qualcomm

January 2023

Launch Date

January 2025

Laptop

Platform

Laptop

CPU Architecture

64-bit architecture

CPU Name

Qualcomm Oryon CPU

Part Number

X1-26-100

N95

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Qualcomm Snapdragon X X1-26-100

Alder Lake

Code Name

CPU Specifications

Boost Frequency

None

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

Efficient-cores

2.0 GHz

Efficient-core Base Frequency

3.4 GHz

Efficient-core Max Turbo Frequency

Maximum E-core turbo frequency derived from Intel® Turbo Boost Technology.

96K per core

L1 Cache

2MB shared

L2 Cache

6MB shared

L3 Cache

100MHz

Bus Frequency

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

30 MB

BGA-1264

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

34x

Multiplier

Unlocked Multiplier

10 nm

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

4nm

6 W

TDP

105°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

3.0

PCIe Version

PCI Express is a high-speed serial computer expansion bus standard used for connecting high-speed components, replacing older standards such as AGP, PCI, and PCI-X. It has gone through multiple revisions and improvements since its initial release. PCIe 1.0 was first introduced in 2002, and in order to meet the growing demand for higher bandwidth, subsequent versions have been released over time.

x86-64

Instruction Set

The instruction set is a hard program stored inside the CPU that guides and optimizes CPU operations. With these instruction sets, the CPU can run more efficiently. There are many manufacturers that design CPUs, which results in different instruction sets, such as the 8086 instruction set for the Intel camp and the RISC instruction set for the ARM camp. x86, ARM v8, and MIPS are all codes for instruction sets. Instruction sets can be extended; for example, x86 added 64-bit support to create x86-64. Manufacturers developing CPUs that are compatible with a certain instruction set need authorization from the instruction set patent holder. A typical example is Intel authorizing AMD, enabling the latter to develop CPUs compatible with the x86 instruction set.

Memory Specifications

Memory Bus Width

16-bit x 8 channels

DDR5-4800

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

LPDDR5x

16GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

64 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

38.4 GB/s

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

135 GB/s

Maximum Memory Speed

8448 MT/s

ECC Memory Support

GPU Specifications

Display Processing Unit

Adreno DPU

External Display Standard

DisplayPort 1.4

GPU Name

Qualcomm Adreno GPU

Max External Display Resolution

3 displays up to UHD 60 Hz HDR10; 2 displays up to 5K 60 Hz or UHD 120 Hz

Max On-Device Display Resolution

Up to QHD+ 120 Hz HDR10

On-Device Display Standard

eDP v1.4b

Video Concurrency

4K 30 FPS 8-bit decode + 1080p 30 FPS encode; 1080p 60 FPS 10-bit decode + 1080p 30 FPS encode

Video Decode

4K 30 FPS 10-bit playback: HEVC, VP9, AV1; 4K 60 FPS 8-bit playback: H.264, HEVC

Video Encode

4K UHD 30 FPS 8-bit recording: H.264, HEVC, AV1

Video Processing Unit

Adreno VPU

True

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

350 MHz

GPU Base Frequency

1200 MHz

GPU Max Dynamic Frequency

Execution Units

The Execution Unit is the foundational building block of Intel’s graphics architecture. Execution Units are compute processors optimized for simultaneous Multi-Threading for high throughput compute power.

0.24 TFLOPS

Graphics Performance

1.7 TFLOPS