Home / CPU Comparison / AMD Ryzen 9 5900HS or AMD Ryzen AI 7 350: What's better?

AMD Ryzen 9 5900HS

vs

AMD Ryzen AI 7 350

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 9 5900HS and AMD Ryzen AI 7 350 processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen AI 7 350

Higher Max Turbo Frequency: Up to 5 GHz (Up to 4.6GHz vs Up to 5 GHz)
Higher Technology: TSMC 4nm FinFET (TSMC 7nm FinFET vs TSMC 4nm FinFET)
Newer PCI Express Version: PCIe® 4.0 (PCIe® 3.0 vs PCIe® 4.0)
Higher Memory Type: DDR5 (FP8), LPDDR5X (FP8) (DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s vs DDR5 (FP8), LPDDR5X (FP8))
Newer Launch Date: February 2025 (January 2021 vs February 2025)

Basic

AMD

Label Name

AMD

January 2021

Launch Date

February 2025

Laptop

Platform

Laptop

Model Name

The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.

Ryzen AI 7 350

Code Name

Krackan Point

Generation

4x Zen 5, 4x Zen 5c

CPU Specifications

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.

3.0GHz

Basic Frequency

2 GHz

Up to 4.6GHz

Max Turbo Frequency

Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Up to 5 GHz

8KB

L1 Cache

4MB

L2 Cache

8 MB

16MB

L3 Cache

16 MB

FP6

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

FP8

TSMC 7nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

TSMC 4nm FinFET

35W

TDP

28W

105°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

100°C

PCIe® 3.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCIe® 4.0

Memory Specifications

DDR4 - Up to 3200 MT/s, LPDDR4 - Up to 4266 MT/s

Memory Type

Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.

DDR5 (FP8), LPDDR5X (FP8)

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

256 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Maximum Memory Speed

4x2R LPDDR5x-8000, DDR5-5600

ECC Memory Support

GPU Specifications

AMD Radeon™ Graphics

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

AMD Radeon™ 860M

2100 MHz

Graphics Frequency

Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel® HD Graphics with Dynamic Frequency feature.

3000 MHz

Graphics Core Count