AMD Ryzen 9 270
vs
Apple M2 Max
vs
CPU Comparison Result
Below are the results of a comparison of
AMD Ryzen 9 270
and
Apple M2 Max
processors based on key performance characteristics, as well as power consumption and much more.
Advantages
- Higher Technology: TSMC 4nm FinFET (TSMC 4nm FinFET vs 5 nm)
- Newer Launch Date: February 2025 (February 2025 vs January 2023)
- More Total Cores: 12 (8 vs 12)
- Larger L3 Cache: 48 MB system level cache (16 MB vs 48 MB system level cache)
Basic
AMD
Label Name
Apple
February 2025
Launch Date
January 2023
Laptop
Platform
Laptop
-
CPU Architecture
Apple Avalanche + Apple Blizzard
-
CPU Name
Apple M2 Max
Ryzen 9 270
Model Name
Apple M2 Max
Hawk Point
Code Name
-
-
Foundry
TSMC
Zen 4
Generation
Apple M2 series
Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit
OS Support
-
CPU Specifications
8
Total Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
12
16
Total Threads
12
-
Performance-cores
8
-
Efficient-cores
4
4 GHz
Basic Frequency
-
Up to 5.2 GHz
Max Turbo Frequency
-
-
Efficient-core Max Turbo Frequency
2.424 GHz
-
Instruction Set Extensions
NEON
-
Performance-core Max Turbo Frequency
3.696 GHz
-
Extended Instruction Set
ARMv8-A, NEON
-
L1 Cache
P-cores: 192 KB instruction + 128 KB data per core; E-cores: 128 KB instruction + 64 KB data per core
8 MB
L2 Cache
P-core cluster: 36 MB; E-core cluster: 4 MB
16 MB
L3 Cache
48 MB system level cache
FP8, FP7, FP7r2
CPU Socket
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
-
No
Unlocked for Overclocking
-
TSMC 4nm FinFET
Technology
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
5 nm
45W
TDP
-
100°C
Max. Operating Temperature
Junction Temperature is the maximum temperature allowed at the processor die.
-
PCIe® 4.0
PCI Express Version
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
-
-
Instruction Set
An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.
ARMv8-A
-
Transistor Count
67 billion
Memory Specifications
-
Memory Bus Width
512-bit
DDR5 (FP8), LPDDR5X (FP8), DDR5 (FP7r2), LPDDR5X (FP7)
Memory Type
Unified LPDDR5-6400
-
LPDDR5 Speed
LPDDR5-6400
256 GB
Max Memory Size
Max memory size refers to the maximum memory capacity supported by the processor.
96 GB
2
Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
-
-
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
400 GB/s
4x2R DDR5-5600
Maximum Memory Speed
6400 MT/s
No
ECC Memory Support
ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
-
GPU Specifications
-
External Display Standard
Thunderbolt 4, HDMI 2.1
-
GPU Name
Apple M2 Max GPU
-
Max External Display Resolution
Up to three 6K 60Hz displays plus one 4K 144Hz display; or up to two 6K 60Hz displays plus one 8K 60Hz / 4K 240Hz display
-
Video Concurrency
Multiple streams of 4K and 8K ProRes video
-
Video Decode
H.264, HEVC, ProRes, ProRes RAW
-
Video Encode
H.264, HEVC, ProRes, ProRes RAW
-
Video Processing Unit
Apple media engine with ProRes acceleration
AMD Radeon™ 780M
Integrated Graphics Model
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
-
-
GPU Max Dynamic Frequency
1400 MHz
12
Graphics Core Count
38
2800 MHz
Graphics Frequency
-
-
Number of Displays Supported
Up to 4 external displays
-
GPU APIs
Metal, OpenCL
-
Graphics Performance
Up to 13.6 TFLOPS FP32
-
Media Engine
Hardware-accelerated H.264, HEVC, ProRes, and ProRes RAW
-
Video Decode Engines
1
-
Video Encode Engines
2
-
ProRes Encode/Decode Engines
2
-
OpenCL Support
OpenCL (Open Computing Language) is a multi-platform API (Application Programming Interface) for heterogeneous parallel programming.
Yes
AI Specifications
-
AI Engine
16-core Apple Neural Engine
-
Neural Engine Core Count
16
-
NPU Name
Apple Neural Engine
-
NPU Performance
15.8 TOPS
Connectivity
-
Bluetooth Support
Yes
-
Bluetooth Version
Bluetooth 5.3
-
Wi-Fi Standard
Wi-Fi 6E (802.11ax)
Interfaces and Ports
-
Thunderbolt Support
Yes, Thunderbolt 4 up to 40 Gb/s
-
USB Version
USB4
-
USB4 Support
Yes, USB4 up to 40 Gb/s
Miscellaneous
-
Hardware-Verified Secure Boot
Yes, Apple silicon secure boot chain of trust
-
Image Signal Processor
Apple image signal processor
-
Runtime Anti-Exploitation
Kernel Integrity Protection, Pointer Authentication Codes, Fast Permission Restrictions
Benchmarks
Geekbench 6 Single Core
Ryzen 9 270
2669
Apple M2 Max
2748
+3%
Geekbench 6 Multi Core
Ryzen 9 270
13180
Apple M2 Max
14754
+12%
Passmark CPU Single Core
Ryzen 9 270
3956
Apple M2 Max
4140
+5%
Passmark CPU Multi Core
Ryzen 9 270
30193
+12%
Apple M2 Max
26868
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