Home / CPU Comparison / AMD Ryzen 9 270 or Apple M1 Ultra: What's better?

AMD Ryzen 9 270

vs

Apple M1 Ultra

CPU Comparison Result

Below are the results of a comparison of AMD Ryzen 9 270 and Apple M1 Ultra processors based on key performance characteristics, as well as power consumption and much more.

Advantages

AMD Ryzen 9 270

Higher Technology: TSMC 4nm FinFET (TSMC 4nm FinFET vs 5 nm)
Newer Launch Date: February 2025 (February 2025 vs March 2022)

Apple M1 Ultra

More Total Cores: 20 (8 vs 20)
Larger L3 Cache: 96 MB system level cache (16 MB vs 96 MB system level cache)

Basic

AMD

Label Name

Apple

February 2025

Launch Date

March 2022

Laptop

Platform

Desktop

CPU Architecture

Apple Firestorm + Apple Icestorm

CPU Name

Apple M1 Ultra

Ryzen 9 270

Model Name

Apple M1 Ultra

Hawk Point

Code Name

Foundry

TSMC

Zen 4

Generation

Apple M1 series

Windows 11 - 64-Bit Edition, Windows 10 - 64-Bit Edition, RHEL x86 64-Bit, Ubuntu x86 64-Bit

OS Support

CPU Specifications

Interconnect Bandwidth

2.5 TB/s

Interconnect Technology

UltraFusion

Total Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

Total Threads

Performance-cores

Efficient-cores

4 GHz

Basic Frequency

Up to 5.2 GHz

Max Turbo Frequency

Efficient-core Max Turbo Frequency

2.064 GHz

Instruction Set Extensions

NEON

Performance-core Max Turbo Frequency

3.228 GHz

Extended Instruction Set

ARMv8-A, NEON

L1 Cache

P-cores: 192 KB instruction + 128 KB data per core; E-cores: 128 KB instruction + 64 KB data per core

8 MB

L2 Cache

P-core clusters: 48 MB total; E-core clusters: 8 MB total

16 MB

L3 Cache

96 MB system level cache

FP8, FP7, FP7r2

CPU Socket

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

Unlocked for Overclocking

TSMC 4nm FinFET

Technology

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

5 nm

45W

TDP

100°C

Max. Operating Temperature

Junction Temperature is the maximum temperature allowed at the processor die.

PCIe® 4.0

PCI Express Version

PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

Instruction Set

An instruction set architecture (ISA) defines the instructions a processor can execute. Common architectures include x86-64, ARM and RISC-V. The ISA determines software compatibility, while optional instruction extensions add specialized capabilities.

ARMv8-A

Transistor Count

114 billion

Memory Specifications

Memory Bus Width

1024-bit

DDR5 (FP8), LPDDR5X (FP8), DDR5 (FP7r2), LPDDR5X (FP7)

Memory Type

Unified LPDDR5-6400

LPDDR5 Speed

LPDDR5-6400

256 GB

Max Memory Size

Max memory size refers to the maximum memory capacity supported by the processor.

128 GB

Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

800 GB/s

4x2R DDR5-5600

Maximum Memory Speed

6400 MT/s

ECC Memory Support

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

GPU Specifications

GPU Name

Apple M1 Ultra GPU

Video Concurrency

Up to 18 streams of 8K ProRes 422 video

Video Decode

H.264, HEVC, ProRes, ProRes RAW

Video Encode

H.264, HEVC, ProRes, ProRes RAW

Video Processing Unit

Apple media engine with ProRes acceleration

AMD Radeon™ 780M

Integrated Graphics Model

An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.

GPU Max Dynamic Frequency

1296 MHz

Graphics Base Frequency

Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.

450 MHz

Graphics Core Count

2800 MHz

Graphics Frequency

Number of Displays Supported

Up to 5 displays

GPU APIs

Metal, OpenCL