AMD Ryzen Embedded R2312

AMD Ryzen Embedded R2312

AMD Ryzen Embedded R2312: Compact Power for Niche Tasks

March 2025


1. Key Specifications: Architecture and Performance

Architecture and Process Technology

The AMD Ryzen Embedded R2312 processor is based on the Zen+ microarchitecture (codename Picasso) and is manufactured using a 12nm process technology. This solution is aimed at embedded systems and compact PCs, where energy efficiency and stability are key factors. Despite the "age" of the architecture, Zen+ remains relevant due to its optimization for low power consumption (TDP of 15W) and support for modern interfaces.

Cores, Threads, and Cache

- 2 Cores / 4 Threads: Suitable for light multitasking scenarios (e.g., office applications + browser).

- L3 Cache 4 MB: Accelerates the processing of frequently used data, which is critical for embedded systems with limited memory bandwidth.

- Radeon Vega 3 (192 SP): Integrated graphics capable of basic gaming and 4K H.265 decoding.

Performance

According to Geekbench 6 tests:

- Single-Core: 959 — Comparable to Intel Core i3-10100T (2020), but lower than modern budget CPUs (e.g., Ryzen 3 7300U: ~1200).

- Multi-Core: 1706 — Weaker than 4-core counterparts but sufficient for background tasks (video surveillance, terminals).

Key Features

- Embedded Optimization: Support for long life cycles (up to 10 years), extended temperature range (-40°C to +105°C).

- Fanless Configurations: With a TDP of 15W, passive cooling systems are possible.


2. Compatible Motherboards

Socket and Chipsets

The processor uses the FP5 socket (BGA version), which means integration into Mini-ITX or NUC format boards. Motherboards with AMD Promontory BGA chipsets are compatible with the R2312, for example:

- ASRock IMB-R2312: Price ~$200–250. Supports HDMI 2.0, USB 3.2 Gen2, 2x Gigabit Ethernet.

- Advantech AIMB-222: ~$280. Focused on industrial applications: moisture and vibration protection.

Selection Considerations

- Interfaces: Look for boards with DisplayPort/HDMI 2.0 for 4K@60Hz.

- Expandability: M.2 for NVMe drives, PCIe x4 for additional controllers (e.g., Wi-Fi 6).


3. Supported Memory

Types and Frequency

The R2312 works with DDR4-2400/2666 MHz in dual-channel mode. The maximum capacity is 32 GB (2x16 GB). DDR5 is not supported, which limits upgrades but reduces the overall system cost.

Recommendations

- Optimal option: 2 modules of 8 GB (e.g., Kingston ValueRAM KVR26N19S6/8) — ~$40 for a set.

- For data storage systems: 16 GB DDR4-2666 + NVMe SSD (e.g., WD Red SN700 500 GB — ~$60).


4. Power Supply Units

Power Calculation

With a TDP of 15W and no discrete graphics, a 150–200W power supply is sufficient. Examples:

- Be Quiet! SFX Power 3 200W: ~$55. Silent, 80+ Bronze efficiency.

- FSP FlexGURU 150W: ~$45. Compact Flex-ATX format.

Tips

- For passive cooling, choose a PSU with a zero fan mode (e.g., Seasonic PRIME Fanless).

- Avoid cheap, noname PSUs: the risk of voltage spikes is critical for embedded systems.


5. Pros and Cons

Advantages

- Energy Efficiency: Ideal for 24/7 operation (e.g., digital signage).

- Vega 3 Graphics: Can handle Dota 2 at low settings (720p, 40–50 FPS) or 4K video.

- Long-Term Support: Software update guarantee until 2030.

Disadvantages

- 2 Cores: Multi-threaded tasks (rendering, streaming) will be a bottleneck.

- Price: ~$130 for the CPU — more expensive than comparable Intel Celeron (e.g., N5105 — ~$90).


6. Use Cases

- Office PCs: Document work, Zoom conferences, web browsing.

- Media Centers: Connection to TV via HDMI 2.0, 4K streaming.

- Industrial Systems: Machine control, IoT gateways.

- Light Gaming: Indie games (Hollow Knight, Stardew Valley) or retro console emulators.

Practical Example

In a smart home project, the R2312 was used as a hub for managing sensors and displaying information on a screen. Power consumption was 8W at idle, 13W under load.


7. Comparison with Competitors

- Intel Celeron N5105 (Jasper Lake): 4 cores, TDP 10W, UHD Graphics. Cheaper (~$90) but weaker in single-threaded tasks (Geekbench 6 Single: ~750).

- Rockchip RK3588 (ARM): 8 Cortex-A76/A55 cores, 8K HDMI. Better for multimedia but has challenges with x86 software compatibility.

- AMD Ryzen Embedded V1605B: 4 cores / 8 threads, Vega 8. More powerful, but TDP of 25W and priced from $200.

Conclusion: The R2312 strikes a balance between x86 compatibility and price but falls short in multi-threading performance.


8. Assembly Tips

1. Case: Mini-ITX (e.g., InWin Chopin Pro — ~$100) or industrial chassis (AAEON GENE-APL5).

2. Cooling: Passive heatsink NoFan CR-80EH (~$30) or Noctua NH-L9a cooler.

3. Storage: Ensure SSD (SATA or NVMe) — HDD will slow down the system.

4. Network: Add Wi-Fi 6 via M.2 card (Intel AX210 — ~$25).


9. Final Conclusion

AMD Ryzen Embedded R2312 is a specialized solution for:

- Compact Office PCs with low power consumption.

- Industrial and IoT Systems that require stability.

- Media Centers where 4K graphics are important.

Do not choose this processor if you need multi-threaded performance or an upgrade to DDR5. However, it remains one of the best in its class for niche tasks due to its reliability and optimization for long-term use.


Prices are current as of March 2025. They are for new devices in retail networks.

Basic

Label Name
AMD
Platform
Desktop
Launch Date
June 2022
Model Name
?
The Intel processor number is just one of several factors - along with processor brand, system configurations, and system-level benchmarks - to be considered when choosing the right processor for your computing needs.
Ryzen Embedded R2312
Code Name
Picasso
Generation
Ryzen Embedded (Zen+ (Picasso))

CPU Specifications

Total Cores
?
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
2
Total Threads
?
Where applicable, Intel® Hyper-Threading Technology is only available on Performance-cores.
4
Basic Frequency
2.7 GHz
Max Turbo Frequency
?
Max Turbo Frequency is the maximum single-core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Turbo Boost Max Technology 3.0 and Intel® Thermal Velocity Boost. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.
up to 3.5 GHz
L1 Cache
96 KB (per core)
L2 Cache
512 KB (per core)
L3 Cache
4 MB (shared)
Bus Frequency
100 MHz
Multiplier
27.0x
CPU Socket
?
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
AMD Socket FP5
Multiplier Unlocked
No
Technology
?
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
12 nm
TDP
15 W
Max. Operating Temperature
?
Junction Temperature is the maximum temperature allowed at the processor die.
105°C
PCI Express Version
?
PCI Express Revision is the supported version of the PCI Express standard. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.
Gen 3, 8 Lanes (CPU only)
Transistors
4,940 million

Memory Specifications

Memory Type
?
Intel® processors come in four different types: Single Channel, Dual Channel, Triple Channel, and Flex Mode. Maximum supported memory speed may be lower when populating multiple DIMMs per channel on products that support multiple memory channels.
DDR4
Memory Channels
?
The number of memory channels refers to the bandwidth operation for real world application.
Dual-channel
ECC Memory
Yes

GPU Specifications

Integrated Graphics Model
?
An integrated GPU refers to the graphics core that is integrated into the CPU processor. Leveraging the processor's powerful computational capabilities and intelligent power efficiency management, it delivers outstanding graphics performance and a smooth application experience at a lower power consumption.
Radeon Vega 3

Benchmarks

Geekbench 6
Single Core Score
959
Geekbench 6
Multi Core Score
1706
Geekbench 5
Single Core Score
827
Geekbench 5
Multi Core Score
1593
Passmark CPU
Single Core Score
1943
Passmark CPU
Multi Core Score
3865

Compared to Other CPU

Geekbench 6 Single Core
1068 +11.4%
1011 +5.4%
911 -5%
867 -9.6%
Geekbench 6 Multi Core
2033 +19.2%
1857 +8.9%
1535 -10%
1394 -18.3%
Geekbench 5 Single Core
862 +4.2%
848 +2.5%
810 -2.1%
794 -4%
Geekbench 5 Multi Core
1844 +15.8%
1692 +6.2%
1494 -6.2%
1417 -11%
Passmark CPU Single Core
1990 +2.4%
1964 +1.1%
1910 -1.7%
1881 -3.2%
Passmark CPU Multi Core
4349 +12.5%
4100 +6.1%
3670 -5%
3504 -9.3%